TSC Industrial Barcode Printer MX Series

1. Ukubekwa kwechungechunge kunye nobugcisa bokwakha

Uluhlu lwe-MX luluhlu lomshicileli ophezulu webhakhowudi ephuhliswe yi-TSC kwizicelo ezinzima zoshishino. Yamkela uyilo lweqonga lemodyuli kwaye ibandakanya iimodeli ezifana neMX240P/MX340P, igxile ekuziqhelaniseni okugqithisileyo kokusingqongileyo kunye nobuchule bokudibanisa imveliso ekrelekrele. Uyilo lwetekhnoloji engundoqo lusekwe kwiintsika ezintathu:

Ishishini 4.0-ukulungele unxibelelwano hub

Ixhotyiswe ngeprosesa ye-ARM ye-ARM ye-Cortex-A9

Ixhasa i-OPC UA ngaphezulu kweprotocol yeTSN

Eyakhelwe-ngaphakathi Modbus TCP/RTU iprotocol yoshishino stack

Inkqubo yokulawula intshukumo echanekileyo

Iitshathi

Ikhowudi

Uyilo oluphuculweyo lokusingqongileyo

Yonke i-aluminium die-cast frame (50G ukuchasana nempembelelo)

Amacandelo obushushu abanzi (-30℃~60℃)

II. Utshintsho lwetekhnoloji engundoqo

1. Itekhnoloji yokulawula i-thermal enamandla

Ukufudumeza kwe-Multi-Zone: Intloko yokuprinta ihlulwe kwiindawo ze-8 zokulawula ukushisa okuzimeleyo

Ialgorithm yembuyekezo yexesha lokwenyani:

inhlwathi

def temp_compensation(into, isantya):

base_temp = 180 # ℃

ukuba imathiriyeli == 'PET':

return base_temp + 15 * (isantya/10)

elif material == 'Polyimide':

return base_temp + 20 * (isantya/8)

2. Inkqubo ekrelekrele yokucubungula imidiya

Umsebenzi Uzalisekiso lobugcisa Izalathisi zokusebenza

Ukufunyaniswa komsantsa okuzenzekelayo kwe-Infrared + CCD udibaniso lwesivamvo ezimbini ±0.1mm ukuchaneka kokubeka

Ukuqhelana noxinzelelo Idamper ye-Electromagnetic + ulawulo lwe-PID Ukuguquguquka <0.5N

Uqikelelo lwedayamitha yoqengqelelo lwedayamitha yokufunda ngomatshini Uqeqesho lomzekelo wokufunda ngomatshini Impazamo yoqikelelo lwemali eseleyo <3%

3. Ukukhuselwa kwinqanaba lomkhosi

Unyango olunobungqina obuthathu:

Ukhuseleko lwesitshizi setyuwa (uvavanyo lwesitshizi setyuwa iiyure ezingama-96)

Ukukhuselwa kokuphazamiseka kombane (EMC Udidi A)

Ukukhuselwa kokutya kwekhemikhali (i-asidi kunye ne-alkali ekwazi ukumelana ne-alkali)

III. I-matrix yemveliso kunye neeparitha eziphambili

Umzekelo Shicilela ububanzi Isantya esiphezulu sokuSombulula iMemori Iimpawu ezikhethekileyo

MX240P 104mm 16ips 300dpi 2GB Imodeli yoshishino esisiseko

MX340P 168mm 14ips 600dpi 4GB Inkxaso HDST imowudi ephezulu echanekileyo

MX540P-RFID 168mm 12ips 300dpi 8GB eDityanisiweyo RAIN RFID encoder

MX640P 220mm 10ips 600dpi 16GB inkqubo yokuprinta kabini intloko ehambelanayo

IV. Iimbalasane zokusebenza ezibalaseleyo

1. Ukuthembeka kwinqanaba lemveliso

MTBF 50,000 iiyure (umyinge kushishino 35,000h)

Ukutshintshwa kwemodyuli ekhawulezayo:

Shicilela intloko esikhundleni <30 imizuzwana

Imodyuli yeRFID eshushu-eguqukayo

2. Ukusebenza okuhlakaniphile kunye nenkqubo yokulondoloza

Ugcino oluqikelelweyo:

Iimonitha zoluvo lokungcangcazela zithwele ukunxiba

I-algorithm yokusetyenziswa kweribhoni yekhabhoni

Uncedo lwe-AR olukude:

Itshathi

Ikhowudi

3. Ikhithi yesicelo esikhethekileyo

Uguqulelo lwegumbi lokucoca (iKlasi ye-1000)

Inguqulelo yobungqina bokudubula (UMmandla we-ATEX 2)

Inguqulelo yebakala lokutya (isiqinisekiso se-FDA 21 CFR)

V. Amatyala esisombululo seshishini

1. Imveliso yeemoto-BMW Leipzig plant

Uqwalaselo: MX340P + i-oyile-resistant carbon ribhoni

Iziphumo:

Ireyibhile yeleyibhile yomgangatho wenjini 99.98%

Ukusebenza kwe-Anti-oyile kwanda ngamaxesha e-3

2. Ulungiselelo lomoya-i-DHL i-aviation hub

Uqwalaselo: MX540P-RFID + ileyibhile echasene nentsimbi

Iziphumo:

Isantya sokuchongwa komgqomo sinyuke nge-40%

Umgama wokufunda ukuya kutsho kwiimitha ezisi-8

3. I-Electronics Manufacturing-Foxconn Zhengzhou

Uqwalaselo: MX240P Ushicilelo lwegumbi elicocekileyo

Iziphumo:

I-90% yokunciphisa ukuveliswa kwamasuntswana

Idibana ne-ISO 14644-1 yeKlasi yesi-5 esemgangathweni

VI. Ukuthelekiswa kobugcisa bokhuphiswano (vs Zebra ZT600)

Iimpawu eziphambili zeMX340P ZT610

Isantya soshicilelo 14ips (356mm/s) 12ips (305mm/s)

Ukulibaziseka konxibelelwano <5ms <15ms

Ukuxhatshazwa kwe-Vibration 50G ukothuka kwe-30G ukothuka

Iprothokholi ixhasa iiprothokholi ezili-9 kwiiprothokholi ezi-4 ezisemgangathweni

Ixabiso lilonke lobunini (iminyaka emi-5) ¥82,000 ¥98,000

Izinto eziluncedo isishwankathelo:

Isantya sinyuke nge-16.7%

Inkxaso yeprothokholi yeshishini yonyuke nge-125%

Iindleko zehliswe nge-19%

VII. Indlela yokuziphendukela kweteknoloji

2024 Q2:

Ikhamera yokuhlola umgangatho we-AI edibeneyo (izinga lokuqaphela isiphene>99.5%)

Khupha isicwangciso sokusingqongileyo seribhoni yekhabhoni esekwe emanzini

2025 isicwangciso:

Intloko yokuprinta efakwe i-Nano (ubomi banda ukuya kwi-80km)

I-Digital twin operation kunye nenkqubo yokulondoloza

VIII. Inkxaso yesigqibo sokuthengwa kweempahla neenkonzo

Isixhobo sokukhetha:

Umququzeleli osemthethweni we-TSC (uguqulelo lwewebhu/weChat applet)

Inkonzo yovavanyo lwesampulu yasimahla

Inkonzo eyongeziweyo kwixabiso:

Isaphulelo sikamatshini osetyenzisiweyo ukuya kuthi ga kwi-30%

Isicwangciso sokugcwalisa izinto ezityiwayo ezihlakaniphile

IX. Izatifikethi ezigunyazisiweyo kunye namabhaso

Isiqinisekiso sokhuseleko:

UL 60950-1

YENZA NTONI?

Iimbasa zeshishini:

2023 iF Imbasa yoYilo lwezoShishino

Ngowama-2024 iLogiMAT iMbasa eGqwesileyo yokuYila

X. Isishwankathelo novavanyo

Uthotho lwe-TSC MX lwakha kwakhona imigangatho yoshicilelo yoshishino olunzima ngokuthembeka kwibakala lomkhosi + Ishishini 4.0 imisebenzi ekrelekrele + imodyuli scalability. I-MTBF yayo ye-50,000 yeyure kunye neempawu ezininzi ze-protocol interconnection ye-industrial interconnection zifanelekile ngokukodwa kwiindawo zokuvelisa eziphezulu ezifana neenqwelo kunye neenqwelomoya. Xa kuthelekiswa nabakhuphisana namazwe ngamazwe, iseke izibonelelo ezibalulekileyo kwiindleko ezipheleleyo zobunini kunye nempendulo yenkonzo yendawo (ukuzinikela kwenkxaso ye-technical iiyure ezi-2), kwaye iye yaba sisiseko esingundoqo sokushicilela kwixesha le-Industrial Internet of Things.