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The TRI TR7007 SIII measures solder paste deposits after stencil printing. Volume, height, area and positional offset provide a fuller picture of the printed deposit than a top-view image alone.
Find printing defects before component placement
Inspection covers missing paste, insufficient or excessive deposits, bridging and deposit deformation. Measurement results support printing process analysis and corrective feedback.
The system combines a 4-megapixel camera with two-way fringe projection. Its 10 μm and 15 μm imaging configurations offer different balances of detail and inspection speed.
TRI TR7007 SIII Core Technical Data
| Parámetro ukaxa | Especificación ukax mä juk’a pachanakanwa |
|---|---|
| Inspection technology | 3D fringe projection |
| Camera | 4 megapixels |
| Imaging resolution | 10 or 15 μm |
| Imaging speed at 10 μm | Up to 90 cm²/s |
| Imaging speed at 15 μm | Up to 200 cm²/s |
| Height resolution | 0.4 μm |
| Maximum PCB size | 510 × 460 mm |
| PCB thickness | 0.5–6 mm |
| PCB weight | 3 kg; optional 5 kg |
