en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The TRI TR7007 SIII measures solder paste deposits after stencil printing. Volume, height, area and positional offset provide a fuller picture of the printed deposit than a top-view image alone.
Find printing defects before component placement
Inspection covers missing paste, insufficient or excessive deposits, bridging and deposit deformation. Measurement results support printing process analysis and corrective feedback.
The system combines a 4-megapixel camera with two-way fringe projection. Its 10 μm and 15 μm imaging configurations offer different balances of detail and inspection speed.
TRI TR7007 SIII Core Technical Data
| פָּרָמֶטֶר | מִפרָט |
|---|---|
| Inspection technology | 3D fringe projection |
| Camera | 4 megapixels |
| Imaging resolution | 10 or 15 μm |
| Imaging speed at 10 μm | Up to 90 cm²/s |
| Imaging speed at 15 μm | Up to 200 cm²/s |
| Height resolution | 0.4 μm |
| Maximum PCB size | 510 × 460 mm |
| PCB thickness | 0.5–6 mm |
| PCB weight | 3 kg; optional 5 kg |
