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TRI TR7007 SIII 3D SPI Solder Paste Inspection Machine

TRI TR7007 SIII 3D SPI Solder Paste Inspection Machine

TRI TR7007 SIII 3D SPI measures solder paste volume, height, area and offset, with 10 or 15 μm imaging resolution and inline process feedback.

Okusaba okw'amangu Email:smt-sales9@gdxinling.cn
Ebisingawo

The TRI TR7007 SIII measures solder paste deposits after stencil printing. Volume, height, area and positional offset provide a fuller picture of the printed deposit than a top-view image alone.

Find printing defects before component placement

Inspection covers missing paste, insufficient or excessive deposits, bridging and deposit deformation. Measurement results support printing process analysis and corrective feedback.

The system combines a 4-megapixel camera with two-way fringe projection. Its 10 μm and 15 μm imaging configurations offer different balances of detail and inspection speed.

TRI TR7007 SIII Core Technical Data

ParameterOkunnyonnyola
Inspection technology3D fringe projection
Camera4 megapixels
Imaging resolution10 or 15 μm
Imaging speed at 10 μmUp to 90 cm²/s
Imaging speed at 15 μmUp to 200 cm²/s
Height resolution0.4 μm
Maximum PCB size510 × 460 mm
PCB thickness0.5–6 mm
PCB weight3 kg; optional 5 kg

TRI TR7007 SIII inline 3D solder paste inspection machine

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Endagiriro y’okutuukirira:No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y’essimu ey’okwebuuza:+86 13823218491

Email:smt-okutunda9@gdxinling.cn

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