SAKI 3Di-MS2 3D AOI Machine | SMT Component Inspection

The SAKI 3Di-MS2 is an M-size, single-lane 3D AOI system for inspecting assembled printed circuit boards. Its single-lane format provides a straightforward conveyor arrangement for production lines that process boards through one inspection path.

The 3Di platform uses 3D measurement alongside optical images to assess mounted components and solder-joint features. Height information adds a measurement dimension beyond conventional 2D appearance checks, helping inspection programs distinguish certain shape-related conditions in the assembled board.

SAKI’s published 3Di-MS2 specifications list a main-body size of approximately 850 × 1,430 × 1,500 mm and a weight of about 850 kg. These dimensions are useful when assessing equipment placement, conveyor alignment and access for routine servicing.

The MS2 platform was offered with different optical configurations across the 3Di series. Published family specifications include 7 μm, 12 μm and 18 μm resolution options, with different height-measurement ranges and image-capture speeds. The installed camera configuration should therefore be checked before comparing inspection detail or throughput between machines.

Specifikationer

Configuration Notes

Dimensions and utility requirements are based on published 3Di-series specifications for the MS2 model. Confirm the individual machine’s camera resolution, supported PCB dimensions, software version and utilities before ordering or installation.