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JT JTE-800 8-Zone Reflow Oven for SMT Assembly

JT JTE-800 8-Zone Reflow Oven for SMT Assembly

JT JTE-800 reflow oven with eight upper and lower heating zones, two cooling zones and chain-and-mesh transport. Request configuration and pricing.

Iarratas Tapa Email:smt-sales9@gdxinling.cn
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Eight upper and eight lower heating zones give the JT JTE-800 separate adjustment points across the reflow process. Zone temperatures and conveyor speed work together to establish the heating ramp, soak period and time above liquidus required by the solder paste and PCB assembly.

The JTE-800 series manual specifies a 3,110 mm heating section followed by two cooling zones. This provides a defined heating and cooling path for boards moving continuously through the oven. Chain and mesh transport accommodate different board-handling requirements, with centre support listed as an option.

For assemblies carrying components with different thermal masses, the relevant result is the measured board profile. Oven setpoints alone do not establish solder-joint temperatures, so a representative populated board should form the basis of process setup.

We quote the JTE-800 with its actual conveyor direction, transport configuration and electrical requirements. This is particularly useful when replacing an existing oven, where rail position and line orientation affect installation.

JT JTE-800 Reflow Oven Specifications

MírSonraíocht
Heating zones8 upper / 8 lower
Heating length3,110 mm in the referenced JTE-series manual
Cooling zones2
Standard maximum PCB width400 mm
Optional maximum PCB width450 mm
Conveyor speed300–2,000 mm/min
Conveyor arrangementChain and mesh
Centre-board supportOptional
Component clearance30 mm above PCB; 25 mm below PCB
Conveyor height900 ±20 mm

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