en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
Eight upper and eight lower heating zones give the JT JTE-800 separate adjustment points across the reflow process. Zone temperatures and conveyor speed work together to establish the heating ramp, soak period and time above liquidus required by the solder paste and PCB assembly.
The JTE-800 series manual specifies a 3,110 mm heating section followed by two cooling zones. This provides a defined heating and cooling path for boards moving continuously through the oven. Chain and mesh transport accommodate different board-handling requirements, with centre support listed as an option.
For assemblies carrying components with different thermal masses, the relevant result is the measured board profile. Oven setpoints alone do not establish solder-joint temperatures, so a representative populated board should form the basis of process setup.
We quote the JTE-800 with its actual conveyor direction, transport configuration and electrical requirements. This is particularly useful when replacing an existing oven, where rail position and line orientation affect installation.
JT JTE-800 Reflow Oven Specifications
| Item | Specificatie |
|---|---|
| Heating zones | 8 upper / 8 lower |
| Heating length | 3,110 mm in the referenced JTE-series manual |
| Cooling zones | 2 |
| Standard maximum PCB width | 400 mm |
| Optional maximum PCB width | 450 mm |
| Conveyor speed | 300–2,000 mm/min |
| Conveyor arrangement | Chain and mesh |
| Centre-board support | Optional |
| Component clearance | 30 mm above PCB; 25 mm below PCB |
| Conveyor height | 900 ±20 mm |
