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Eight upper and eight lower heating zones give the JT JTE-800 separate adjustment points across the reflow process. Zone temperatures and conveyor speed work together to establish the heating ramp, soak period and time above liquidus required by the solder paste and PCB assembly.
The JTE-800 series manual specifies a 3,110 mm heating section followed by two cooling zones. This provides a defined heating and cooling path for boards moving continuously through the oven. Chain and mesh transport accommodate different board-handling requirements, with centre support listed as an option.
For assemblies carrying components with different thermal masses, the relevant result is the measured board profile. Oven setpoints alone do not establish solder-joint temperatures, so a representative populated board should form the basis of process setup.
We quote the JTE-800 with its actual conveyor direction, transport configuration and electrical requirements. This is particularly useful when replacing an existing oven, where rail position and line orientation affect installation.
JT JTE-800 Reflow Oven Specifications
| 목 | 사양 |
|---|---|
| 난방 구역 | 8 상단 / 8 하단 |
| Heating length | 3,110 mm in the referenced JTE-series manual |
| 냉각 구역 | 2 |
| Standard maximum PCB width | 400mm |
| Optional maximum PCB width | 450 mm |
| Conveyor speed | 300–2,000 mm/min |
| Conveyor arrangement | Chain and mesh |
| Centre-board support | Optional |
| Component clearance | 30 mm above PCB; 25 mm below PCB |
| 컨베이어 높이 | 900 ±20 mm |
