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ASM E by SIPLACE CP12 Placement Machine

ASM E by SIPLACE CP12 Placement Machine

ASM E by SIPLACE CP12 handles packages up to 18.7 × 18.7 mm and 7.5 mm high. Includes the key configuration distinction between CP12 and CP12/PP.

Gusaba Byihuse Email:smt-sales9@gdxinling.cn
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Packages up to 18.7 × 18.7 mm and 7.5 mm high fall within the published CP12 component range. Alongside its 01005 capability, this gives the E by SIPLACE CP12 configuration coverage of small chips and larger packages within those limits.

The head has an optimum rating of 24,300 CPH. Compared with CP14, it trades some small-component speed for a wider size and height envelope, which changes the share of a board’s placements it can handle.

CP12 must also be distinguished from CP12/PP. The latter has separate handling specifications and operating capabilities; its larger-component limits should not appear in a standard CP12 product specification.

ASM E by SIPLACE CP12 Placement Machine

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Umuyobozi umwe wo gukemura umuyobozi wa chip mounter

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Nkumuntu utanga ibikoresho byinganda zikora ibikoresho bya elegitoroniki, Geekvalue itanga imashini zitandukanye kandi zikoreshwa hamwe nibikoresho biva mubirango bizwi kubiciro byapiganwa cyane.

Aderesi ya:No 18, Umuhanda w'inganda Shangliao, Umujyi wa Shajing, Akarere ka Baoan, Shenzhen, Ubushinwa

Inomero ya terefone:+86 13823218491

Imeri:smt-sales9@gdxinling.cn

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