en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
Packages up to 18.7 × 18.7 mm and 7.5 mm high fall within the published CP12 component range. Alongside its 01005 capability, this gives the E by SIPLACE CP12 configuration coverage of small chips and larger packages within those limits.
The head has an optimum rating of 24,300 CPH. Compared with CP14, it trades some small-component speed for a wider size and height envelope, which changes the share of a board’s placements it can handle.
CP12 must also be distinguished from CP12/PP. The latter has separate handling specifications and operating capabilities; its larger-component limits should not appear in a standard CP12 product specification.
