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Solder joints and component leads can look very different from above and from an angle. The MIRTEC MV-7xi combines top-down inspection with available SIDE-VIEWER cameras, providing additional views of areas that are difficult to assess from a single image.
Its three-stage conveyor separates board entry, inspection and exit within the machine. Telecentric optics support image-based evaluation of component position, polarity and visible assembly defects. Machines equipped with laser inspection can also perform specified height and coplanarity checks.
When we quote an MV-7xi, the camera resolution, side-view hardware and laser configuration are listed individually. This keeps the equipment specification tied to the machine being offered.
MIRTEC MV-7xi Core Technical Specifications
| ພາລາມິເຕີ | ຂໍ້ມູນຈໍາເພາະ |
|---|---|
| ຕົວແບບ | MV-7xi |
| Equipment Type | Inline AOI |
| Maximum PCB Size | 510 × 460 mm |
| Conveyor System | Three-stage conveyor |
| Top-Down Camera Options | 5 MP or 10 MP |
| Pixel Resolution Options | 9.8 / 13.4 / 18.2 μm per pixel |
| Side-View Camera Option | Four 5 MP or 10 MP cameras |
| Standard Top-Side Clearance | 45 mm |
| Main Body Dimensions | W1,100 × D1,530 × H1,500 mm |
| ນ້ຳໜັກເຄື່ອງ | Approximately 1,000 kg |
