asm waya Ekyuma kya Bonder ab550

ASM Wire Bonder AB550 ye waya bonder ya ultrasonic ekola obulungi ng’erina emirimu mingi egy’omulembe n’ebintu.

Ebintu eby'enjawulo

Obusobozi bw’okusiba waya ku sipiidi: Ekiyungo kya waya ekya AB550 kirina obusobozi bw’okusiba waya ku sipiidi era kisobola okusiba waya 9 buli sikonda.

Obusobozi bw’okuweta mu ngeri ya micro-pitch: Ekyuma kino kirina obusobozi bw’okuweta mu ngeri ya micro-pitch nga kirimu sayizi y’ekifo ky’okuweta ekitono ennyo nga 63 μm x 80 μm ate nga n’obuwanvu bw’ekifo ky’okuweta obutono bwa 68 μm.

Dizayini empya ey’entebe y’okukoleramu: Dizayini y’entebe y’okukoleramu efuula okuweta okwangu, okutuufu era okunywevu.

Large welding range: The effective wire bonding range is wide, esaanira okukozesebwa mu bintu eby’enjawulo, era erongoosa efficiency okufulumya.

Dizayini y'okuddaabiriza "Zero": Dizayini ekendeeza ku byetaago by'okuddaabiriza n'okukendeeza ku nsaasaanya y'okufulumya.

Tekinologiya w’okutegeera ebifaananyi: Tekinologiya w’okutegeera ebifaananyi alina patent alongoosa obusobozi bw’okufulumya.

Ebitundu by’okukozesa n’ebirungi ebirimu

AB550 wire bonder ekozesebwa nnyo mu kisaawe ky’okupakinga semiconductor naddala mu mbeera z’okufulumya ezeetaaga obutuufu obw’amaanyi n’obulungi obw’amaanyi. Obusobozi bwayo obw’okusiba waya ku sipiidi n’okuweta micro-pitch bugiwa enkizo ennene mu mulimu gw’okukola ebyuma, ekiyinza okulongoosa ennyo enkola y’okufulumya n’omutindo gw’ebintu. Okugatta ku ekyo, ekika kyayo ekinene ennyo eky'okuweta n'enkola yaayo ey'okuddaabiriza "zero" byongera okutumbula omuwendo gwayo ogw'okukozesa mu kukola mu makolero.

Ebirungi ebiri mu kyuma ekisiba waya za ASM AB550 okusinga mulimu bino wammanga: Okukendeeza ku nsimbi: Omuwendo gw’ebintu ebikozesebwa mu kusiba waya za aluminiyamu guli wansi nnyo okusinga ogw’okusiba waya za zaabu, ekifuula AB550 okubeera ey’ebyenfuna mu kukozesa okumala ebbanga eddene. Omulimu gw’okuweta: Waya ya aluminiyamu erina ebyetaago ebitono ku ngulu w’ekyuma ekiweta. Kiyinza okuweta nga kiyita mu oxidation oba electroplating, era obudde bw’okuweta buba bumpi. Tekyetaagisa flux, gas oba solder, ekyongera okukendeeza ku ssente z’okukozesa. Obusobozi bw’okutwala masanyalaze amangi: Waya ya aluminiyamu erina dayamita ya waya enzito era esobola okugumira amasannyalaze amanene. Esaanira nnyo okuweta ebyuma by’amaanyi era ekozesebwa nnyo mu byuma eby’amasannyalaze ebyetaaga okufuluma kwa kasasiro omungi.