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The Viscom iS6059 combines three-dimensional measurement with angled camera views to inspect assembled PCBs. Height information helps evaluate lifted leads and tilted components, while the angled views reveal solder joints and component features that are difficult to assess from directly above.
The PCB Inspection version offers XMs-II and XM8-II camera configurations. These provide different combinations of image resolution, field of view and inspection speed, allowing the optical setup to be matched to the assembly’s smallest features and production cycle.
Board review is part of the inspection workflow. Viscom verification software allows flagged locations to be examined before a board is assigned for rework, while statistical process control functions can help production teams identify recurring defects.
We supply the iS6059 according to its installed sensor configuration and software package. The quotation identifies the inspection version, board-handling arrangement and included verification functions so buyers can compare complete machine configurations.
Viscom iS6059 PCB Inspection Specifications
| Tūemi | Whakatakotoranga |
|---|---|
| Inspection type | Inline 3D automated optical inspection |
| Camera configurations | XMs-II or XM8-II |
| Angled-view cameras | 8 |
| Orthogonal image resolution | 10 µm with XMs-II; 8 µm with XM8-II |
| Z-resolution | 0.5 µm |
| Published Z-range | Up to 30 mm |
| Inspection speed | Up to 65 cm²/s with XMs-II; 50 cm²/s with XM8-II |
| Maximum PCB size | 508 × 508 mm |
| Longboard option | PCB length up to 720 mm |
| System dimensions, W × D × H | 997 × 1,756 × 1,753 mm |
