en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The Yamaha YSi-V combines top-view inspection with available 3D measurement and four-direction oblique imaging. These inspection methods address different features: top-view images show component position and visible defects, while height data and angled views provide additional information around component bodies and soldered leads.
The 12 MP platform offers 7 μm or 12 μm resolution configurations. Standard single-lane board handling accommodates assemblies up to 610 × 560 mm, with an optional long-board configuration.
For buyers comparing machines, the installed inspection package matters as much as the YSi-V model name. We identify camera resolution, 3D capability and oblique-view hardware separately.
Yamaha YSi-V Core Technical Specifications
| Tawhā | Whakatakotoranga |
|---|---|
| Tauira | YSi-V |
| Equipment Type | Hybrid automated optical inspection |
| Camera | 12 MP, referenced configuration |
| Resolution Options | 7 μm / 12 μm |
| Standard Single-Lane PCB Size | 50 × 50 to 610 × 560 mm |
| Optional PCB Length | Up to 750 mm |
| 3D Inspection | Configuration-dependent option |
| Oblique Inspection | Four-direction camera option |
| Whakawhiwhia Air | Clean, dry air at ≥0.45 MPa |
| Ahu Miihini | L1,252 × W1,498 × H1,550 mm, excluding projections |
| Taumaha Miihini | Approximately 1,300 kg |
