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Yamaha YSi-V Hybrid 3D AOI System

Yamaha YSi-V Hybrid 3D AOI System

Explore Yamaha YSi-V inspection with 12 MP imaging, 7 or 12 μm resolution and optional 3D and angled-view capabilities. Request configuration details.

Gusaba Byihuse Email:smt-sales9@gdxinling.cn
Ibisobanuro

The Yamaha YSi-V combines top-view inspection with available 3D measurement and four-direction oblique imaging. These inspection methods address different features: top-view images show component position and visible defects, while height data and angled views provide additional information around component bodies and soldered leads.

The 12 MP platform offers 7 μm or 12 μm resolution configurations. Standard single-lane board handling accommodates assemblies up to 610 × 560 mm, with an optional long-board configuration.

For buyers comparing machines, the installed inspection package matters as much as the YSi-V model name. We identify camera resolution, 3D capability and oblique-view hardware separately.

Yamaha YSi-V Core Technical Specifications

ParameterIbisobanuro
IcyitegererezoYSi-V
Equipment TypeHybrid automated optical inspection
Camera12 MP, referenced configuration
Resolution Options7 μm / 12 μm
Standard Single-Lane PCB Size50 × 50 to 610 × 560 mm
Optional PCB LengthUp to 750 mm
3D InspectionConfiguration-dependent option
Oblique InspectionFour-direction camera option
Isoko ryo mu kirereClean, dry air at ≥0.45 MPa
Ibipimo by'imashiniL1,252 × W1,498 × H1,550 mm, excluding projections
Uburemere bwimashiniApproximately 1,300 kg

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Aderesi ya:No 18, Umuhanda w'inganda Shangliao, Umujyi wa Shajing, Akarere ka Baoan, Shenzhen, Ubushinwa

Inomero ya terefone:+86 13823218491

Imeri:smt-sales9@gdxinling.cn

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