en
ori
alb
amh
ara
arm
aym
aze
bel
ben
bos
bul
bur
cs
dan
de
div
el
est
fil
fin
fra
gle
glg
grn
heb
hi
hkm
hrv
hu
ice
id
it
jp
kan
kin
kor
lao
lav
lit
ltz
lug
mao
may
mlt
nep
nl
nor
nya
orm
per
pl
pt
rom
ru
san
sk
som
spa
srp
swa
swe
tam
th
tr
ukr
urd
vie
wel
xho
The MIRTEC MV-3 OMNI provides three-dimensional assembly inspection in a desktop format. It gives production and quality teams a separate inspection station for prototype boards, batch production and process verification.
OMNI-VISION combines camera imaging with Moiré-based 3D measurement. Height information supports checks for lifted packages, raised leads and visible solder fillet conditions, adding measurable geometry to conventional image inspection.
The platform supports inspection before and after reflow, with programming tools and component libraries that help build repeatable inspection routines. SIDE-VIEWER cameras and other features depend on the machine configuration.
We match the offered MV-3 OMNI to your board size and inspection priorities, with its camera and projection configuration clearly identified.
MIRTEC MV-3 OMNI Core Technical Specifications
| Tawhā | Whakatakotoranga |
|---|---|
| Tauira | MV-3 OMNI |
| Equipment Type | Desktop 3D AOI |
| PCB Inspection Area | 50 × 50 to 450 × 400 mm |
| Top-Down Camera Options | 15 MP or 25 MP CoaXPress |
| Pixel Resolution Options | 15 / 10 μm with 15 MP camera; 7.7 μm with 25 MP camera |
| 3D Measurement Technology | Digital tri-frequency Moiré, 12-projection blue DLP |
| Maximum 3D Inspection Height | 25 mm |
| Lighting System | Eight-phase colour LED |
| Standard PCB Thickness | 0.5–3 mm |
| Maximum PCB Weight | 3 kg |
