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The JT NS-800II-N combines an eight-zone upper heating system with eight lower heating zones, allowing the PCB to receive heat from both sides as it moves through the oven. Its nitrogen configuration is intended for reflow processes that require an inert atmosphere to limit oxidation during soldering.
The heating and cooling stages work together to follow the thermal profile required by the solder paste and assembled components. With two cooling zones listed in the NS-800 series specifications, the machine supports controlled cooling after the solder reaches reflow temperature.
The conveyor accommodates PCBs up to 400 mm wide, with motorized rail adjustment across a 50–400 mm range. This range gives production engineers room to configure the conveyor for different board widths without manually rebuilding the rail arrangement for every product change.
For line planning, the oven's overall dimensions are approximately 5,606 × 1,350 × 1,440 mm. Confirm the exact NS-800II-N electrical requirements, conveyor direction and nitrogen-control options against the supplied machine configuration before installation.
JT NS-800II-N Nitrogen Reflow Oven Specifications
| Paarameetarii | Ispeesifikeeshinii |
|---|---|
| Maqaa oomishaa | JT |
| Adda duree | NS-800II-N |
| Equipment type | SMT nitrogen reflow oven |
| Upper heating zones | 8 |
| Lower heating zones | 8 |
| Cooling zones | 2 |
| Maximum PCB width | 400 mm ta’a |
| Conveyor rail adjustment | 50–400 mm |
| Temperature setting range | Room temperature to 300°C |
| Temperature control | PID closed-loop control with SSR |
| Temperature control precision | ±1°C |
| PCB temperature deviation | ±1.5°C, according to JT board test standard |
| Conveyor height | Approx. 900 ± 20 mm |
| Machine dimensions (L × W × H) | Approx. 5,606 × 1,350 × 1,440 mm |
| Ulfaatina | Approx. 2,250 kg; confirm exact configuration |
| Electrical supply and power | Confirm from the NS-800II-N nameplate |
| Nitrogen configuration | Yes, indicated by the “N” suffix |
