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Semiconductor equipment FAQ
Its dynamic range is very wide, with a typical value of 130dB (IFBW 10Hz), capable of handling highly similar measurement tasks
V93000 can achieve test speeds up to 100GHz, meeting high-speed and invalid high-speed testing needs
It can meet a variety of LED packaging specifications, including common products such as 3528 and 5050
The wire bonding speed reaches 1.8K (four wires plus four gold balls), significantly improving production efficiency
Its instantaneous production capacity can reach 15,000UPH, which is equivalent to twice the factory production capacity
MAXUM PLUS In most applications, productivity (UPH) is increased by 10% over the previous generation
YSH20 has a placement capability of up to 4,500 UPH (0.8 seconds/Unit), which is the top placement capability among flip chip placement machines
Production capacity Datacon 8800 has extremely high production efficiency and can significantly improve production speed. For example
Chip Placer Type: C&P20 M2 CPP M, placement accuracy ±15 μm at 3σ.
DAD323 can handle processing objects up to 6 inches square,
DAD324 is suitable for various scenarios that require high-precision and miniaturized cutting
DAD3230 has excellent scalability and can handle a variety of processing materials and processing methods
Servo motors are used for all X, Y, and Z axes, achieving high-speed axes and improved productivity.
Double-sided cooling (DSC) mold solution is available to ensure temperature control during the plastic sealing process.
IdealMold™ R2R supports flexible programming and is suitable for different molding needs.
Automatic and precise loading/unloading for high-volume production.
11 degrees of freedom for improved calibration quality
●TO-can packaging processing capability
Able to handle small molds (as low as 3 mil) and large substrates (up to 270 x 100 mm), suitable for a variety of application scenarios.
The die bonder is also equipped with other auxiliary equipment, such as fans and cooling devices
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