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ASM chip mounter AD819 is an advanced semiconductor packaging equipment used to accurately place chips on substrates. It is a key equipment in the automated chip mounting process.
AD819 series fully automatic ASMPT chip mounting system
Features
●TO-can packaging processing capability
●Accuracy ± 15 µm @ 3s
●Eutectic chip mounting process (AD819-LD)
●Dispensing chip mounting process (AD819-PD)
The working principle of the ASM chip mounter mainly includes the following steps:
Positioning PCB: The ASM mounter first uses sensors to determine the position and direction of the PCB to ensure that the components can be accurately placed in the predetermined position.
Providing components: The mounter takes components from the feeder. The feeder usually uses a vibrating plate or a conveying system with a vacuum nozzle to transport components.
Identifying components: Components are identified by a visual system to ensure the correctness of the selected components.
Place components: Use a placement head to attach components to the PCB and cure the paste with hot air or infrared rays
