yamaha flip chip bonder YSH20

The advantages of Yamaha's YSH20 die bonder mainly include the following aspects:

High placement capability and high precision: YSH20 has a placement capability of up to 4,500 UPH (0.8 seconds/Unit), which is the top placement capability among flip chip placement machines. Its placement accuracy can reach ±10µm (3σ), ensuring high-precision placement effect. ‌

‌Wide component placement range‌: The equipment can place components from 0.6x0.6mm to 18x18mm, suitable for chips and components of various sizes. ‌

‌Multiple component supply forms‌: YSH20 supports multiple component supply forms, including wafers (6-inch, 8-inch, 12-inch flat rings), honeycomb trays and tape trays (width 8, 12, 16 mm), meeting different production needs. ‌

‌Powerful power and gas source requirements‌: The equipment uses a three-phase power supply, and the gas source requirement is above 0.5MPa, ensuring the stable operation of the equipment. ‌

‌Flexible substrate size support‌: YSH20 can handle substrates from L50 x W30 to L340 x W340 mm, and can support up to L340 x W340 mm substrates to meet the needs of substrates of different sizes ‌

‌YWF wafer supply device‌: The equipment is equipped with a YWF wafer supply device, which supports 6, 8, and 12-inch wafers and has a θ angle compensation function, which further improves the flexibility and accuracy of the equipment ‌