Yamaha flip chip bonder YSH20

Faa'iidooyinka Yamaha's YSH20 ayaa u dhinta bonder inta badan waxaa ka mid ah dhinacyada soo socda:

Awood meelaynta sare iyo saxnaanta sare: YSH20 waxay leedahay awood meelayn ah ilaa 4,500 UPH (0.8 sekan/cutub), taas oo ah awooda meelaynta sare ee mashiinada meelaynta jajabka. Saxnaanta meeleynteeda waxay gaari kartaa ± 10µm (3σ), iyadoo hubinaysa saamaynta meelaynta-sare ee saxda ah.

Meelaynta qaybaha ballaaran: Qalabku wuxuu dhigi karaa qaybaha 0.6x0.6mm ilaa 18x18mm, oo ku habboon jajabyada iyo qaybaha cabbirrada kala duwan.

Foomamka sahayda ka kooban oo badan: YSH20 waxay taageertaa noocyo badan oo sahayda ah, oo ay ku jiraan maraqa (6-inch, 8-inch, 12-inch rings flat), saxarada malabka iyo cajaladaha cajaladaha (ballaaran 8, 12, 16 mm), buuxinta baahiyaha wax soo saarka ee kala duwan.

Shuruudaha ilaha tamarta iyo gaaska: Qalabku wuxuu isticmaalaa sahay koronto oo saddex weji ah, iyo baahida isha gaasku waxay ka sarreysaa 0.5MPa, hubinta hawlgalka xasilloon ee qalabka.

Taageerada cabbirka substrate dabacsan: YSH20 waxay xamili kartaa substrates L50 x W30 ilaa L340 x W340 mm, oo waxay taageeri kartaa ilaa L340 x W340 mm substrates si loo daboolo baahiyaha substrates cabbiro kala duwan

Qalabka sahayda wafer-ka ee YWF: Qalabku wuxuu ku qalabaysan yahay aaladda YWF wafer, kaas oo taageera 6, 8, iyo 12-inch wafers wuxuuna leeyahay shaqada magdhowga xagal θ, kaas oo sii wanaajinaya dabacsanaanta iyo saxnaanta qalabka