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MAXUM PLUS In most applications, productivity (UPH) is increased by 10% over the previous generation
The wire bonding speed reaches 1.8K (four wires plus four gold balls), significantly improving production efficiency
It can meet a variety of LED packaging specifications, including common products such as 3528 and 5050
The sensor detects the position and angle of the chip or substrate and transmits the data to the laser generator .
The workbench design makes welding faster, more accurate and more stable.
The ASMPT AERO CAM series wire bonder is specially designed for camera module packaging
The AB589 wire bonder is a high-efficiency wire bonding equipment produced by ASMPT
The wire bonding accuracy of this wire bonder reaches ±2 microns
The wire bonder performs well in long-term operation and has high stability, which can ensure the continuity and reliability of the production process
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As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
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