wire bonder

wire bonder

wire bonder

‌Wire bonder‌ is a device used to connect metal leads to substrate pads. It is mainly used to connect the input and output ends of the chip with the application device, thereby completing the electrical interconnection between the chip and the substrate and the information exchange between the chips. Wire bonders are usually used in semiconductor packaging and testing, especially in the LED lighting and electronic display industries. ‌

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