Semiconductor equipment

Semiconductor Equipment

Semiconductor machine

The main function of packaging equipment is to cut and seal the wafers after production and processing, and then process them into finished chips. The packaging process includes wafer thinning, wafer cutting, chip mounting, welding bonding, plastic sealing process, post-curing process, testing, marking process (electroplating, bending, laser printing), packaging, warehouse inspection, shipping and other processes. The role of packaging is to protect chip performance, reduce technical difficulty, and improve product performance and yield rate.

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GEEKVALUE

Geekvalue: Born for Pick-and-Place Machines

One-stop solution leader for chip mounter

About Us

As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.

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