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ASMPT Die Bonder AD211 Plus has the following advantages and specifications:
High-efficiency packaging capability: AD211 Plus can achieve void-free eutectic, UPH (output per hour) reaches 7k, significantly improving production efficiency
High precision: The equipment has high-precision performance and can achieve precision control of ±7um@3σ and ±1°@3σ
Versatility: AD211 Plus is suitable for a variety of application scenarios, including eutectic packaging of high-power and high-brightness LED chips, UV deep ultraviolet treatment, etc.
High automation level: The equipment has functions such as automatic welding head level correction, segmented heating zone workbench, and die bonding chip laser temperature detection, which improves the automation and accuracy of the production process
High performance: AD211 Plus can use and detect nitrogen-hydrogen mixed gas in independent partitions, further improving the performance and applicability of the equipment.
Applicable industries and specific application scenarios:
Advanced packaging: Applicable to eutectic packaging of high-power and high-brightness LED chips, especially in optical communications, automotive headlights and other fields.
Semiconductor manufacturing: In the manufacturing process of semiconductor equipment, AD211 Plus can provide efficient and precise packaging solutions
