Ebyuma bya ASM die bonder AD211 Plus

ASMPT Die Bonder AD211 Plus erina ebirungi bino wammanga n’ebigikwatako:

Obusobozi bw’okupakinga obulungi ennyo: AD211 Plus esobola okutuuka ku void-free eutectic, UPH (okufulumya buli ssaawa) etuuka ku 7k, okulongoosa ennyo obulungi bw’okufulumya

Obutuufu obw’amaanyi: Ebyuma birina omulimu ogw’obutuufu obw’amaanyi era bisobola okutuuka ku kufuga okutuufu okwa ±7um@3σ ne ±1°@3σ

Versatility: AD211 Plus esaanira enkola ez’enjawulo ez’okukozesa, omuli okupakinga eutectic chips za LED ez’amaanyi amangi n’ezimasamasa ennyo, okujjanjaba UV deep ultraviolet, n’ebirala.

High automation level: Ebyuma bino birina emirimu nga automatic welding head level correction, segmented heating zone workbench, ne die bonding chip laser temperature detection, ekirongoosa automation n’obutuufu bw’enkola y’okufulumya

Omulimu gwa waggulu: AD211 Plus esobola okukozesa n’okuzuula omukka ogutabuddwamu nayitrojeni-hayidirojeni mu bitundu ebyetongodde, okwongera okulongoosa omulimu n’okukozesebwa kw’ebyuma.

Amakolero agakola n’embeera ezenjawulo ez’okukozesa:

Okupakinga okw’omulembe: Kukozesebwa ku kupakinga kwa eutectic okwa chips za LED ez’amaanyi amangi n’ezimasamasa ennyo naddala mu mpuliziganya ey’amaaso, amataala g’emmotoka n’emirimu emirala.

Okukola semiconductor: Mu nkola y’okukola ebyuma bya semiconductor, AD211 Plus esobola okuwa eby’okupakinga ebirungi era ebituufu