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I-ASMPT Die Bonder AD211 Plus inezi zibonelelo zilandelayo kunye neenkcukacha:
Ikhono lokupakisha eliphezulu: I-AD211 Plus inokufezekisa i-eutectic engenanto, i-UPH (imveliso ngeyure) ifikelela kwi-7k, iphucula kakhulu ukusebenza kakuhle kwemveliso.
Ukuchaneka okuphezulu: Isixhobo sinomsebenzi ophezulu wokuchaneka kwaye sinokufikelela ulawulo oluchanekileyo lwe-±7um@3σ kunye ±1°@3σ.
I-Versatility: I-AD211 Plus ilungele iimeko ezahlukeneyo zesicelo, kubandakanya ukupakishwa kwe-eutectic yamandla aphezulu kunye nokukhanya okuphezulu kwee-chips ze-LED, unyango lwe-UV olunzulu lwe-ultraviolet, njl.
Inqanaba eliphezulu lokuzenzekelayo: Isixhobo sinemisebenzi efana nokulungiswa kwenqanaba lentloko ye-welding ngokuzenzekelayo, i-segmented zone workbench, kunye ne-die bonding chip laser yokufumanisa ubushushu, okuphucula ukuzenzekelayo kunye nokuchaneka kwenkqubo yokuvelisa.
Ukusebenza okuphezulu: I-AD211 Plus inokusebenzisa kwaye ibone igesi edibeneyo ye-nitrogen-hydrogen kwizahlulo ezizimeleyo, iphucula ngakumbi ukusebenza kunye nokusebenza kwezixhobo.
Amashishini asebenzayo kunye neemeko ezithile zesicelo:
Ukupakishwa okuphezulu: Kusetyenziswa kwi-eutectic ukupakishwa kwamandla aphezulu kunye nokukhanya okuphezulu kwe-chips ze-LED, ngakumbi kunxibelelwano lwe-optical, izibane zemoto kunye nezinye iindawo.
Ukwenziwa kweSemiconductor: Kwinkqubo yokwenziwa kwezixhobo ze-semiconductor, i-AD211 Plus inokubonelela ngezisombululo zokupakisha ezisebenzayo nezichanekileyo.
