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ASM die bonder machine AD832i

ASM die bonder machine AD832i

The ASM AD832i die bonder significantly improves production efficiency through its efficient workflow and automated operation

State: In stock:have Warranty:supply
Details

The advantages and functions of the ASM AD832i die bonder mainly include the following aspects‌‌:

Advantages

‌High efficiency‌‌: The ASM AD832i die bonder significantly improves production efficiency through its efficient workflow and automated operation. Its high efficiency and high efficiency make it perform well in the LED packaging industry and can maximize packaging efficiency‌

‌Accuracy‌‌: The die bonder is equipped with an advanced visual system and motion system, which can achieve positioning die bonding operations. Through the precise positioning of the visual system, the motion system ensures that the die bonding head moves accurately to the specified position, so that the LED chip can be accurately installed on the motherboard

High degree of automation: ASM AD832i die bonding machine has a high degree of automation, which reduces manual intervention, reduces labor costs, and reduces the possibility of human error. ‌

Functions

‌Light source system‌: ASM AD832i die bonding machine is equipped with an advanced light source system that can provide sufficient light intensity and uniformity to ensure that the chip is clearly visible during the die bonding process

‌Motion system‌: Its motion system is precisely designed and can quickly and accurately move the die bonding head to the specified position to ensure that the chip can be accurately fixed on the motherboard. ‌

‌Visual system‌: Through the position vision system, ASM AD832i can achieve accurate positioning of the chip to ensure the accuracy of each die bonding operation. ‌

Die bonding system: The die bonding system is responsible for fixing the chip on the chip to ensure the speed and stability of the chip

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