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BESI Die Bonder Machine Datacon 8800

BESI Die Bonder Machine Datacon 8800

Production capacity Datacon 8800 has extremely high production efficiency and can significantly improve production speed. For example

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Details

The advantages of Datacon 8800 are mainly reflected in its efficient production capacity, flexibility and accuracy. Production capacity Datacon 8800 has extremely high production efficiency and can significantly improve production speed. For example, its Datacon 8800 TCadvanced model performs well in TSV applications and has unparalleled production stability. In addition, the Datacon 8800 FC model's chip mounter operating system is based on Linux and can reach up to 10,000 UPH (output per hour), further demonstrating its advantages in production capacity. Flexibility and accuracy Datacon 8800 also excels in flexibility. Its bonding head supports 7-axis operation, which can provide higher flexibility and accuracy in complex production environments. In addition, the Datacon 8800 TCadvanced model supports a variety of process controls, which can adapt to different production needs and ensure the stability and reliability of the production process. In terms of flexibility, the Datacon 8800 TCadvanced supports FO-WLP (Wafer-Level Fan-Out Packaging) technology, which is suitable for various chip mounting processes and supports both face-down and face-up design modes, further enhancing its flexibility in practical applications

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