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The advantages of ASMPT die bonder AD8312 Plus mainly include ultra-fast and positioning, excellent glue dripping control system and processing capabilities suitable for high-density fiber optic frames
Specific advantages
Ultra-fast and positioning: AD8312 Plus positioning die bonder combines the advantages of ultra-fast and positioning, can accurately complete the die bonding task, and ensure the positioning die bonding effect
Excellent glue dripping control system: The excellent glue dripping control system of this equipment can accurately control the glue dripping process to ensure the quality and stability of the die bonding
Suitable for high-density reading frames: AD8312 Plus's universal worktable design is suitable for processing high-density reading frames to meet the needs of different markets
Applicable scenarios and user reviews
AD8312 Plus is suitable for integrated circuit and discrete component applications, especially for processing 12-inch wafer die bonding tasks. Its high capacity and flexible quota have set new standards in the market and can meet various complex application requirements
