ASM umatshini bonder AD832i

Izinto eziluncedo kunye nemisebenzi ye-ASM AD832i die bonder ikakhulu ibandakanya le miba ilandelayo:

Iingenelo

Ukusebenza okuphezulu: I-ASM AD832i die bonder iphucula kakhulu ukusebenza kwemveliso ngokuhamba kwayo okusebenzayo kunye nokusebenza okuzenzekelayo. Ukusebenza kwayo okuphezulu kunye nokusebenza okuphezulu kuyenza isebenze kakuhle kwishishini lokupakisha le-LED kwaye inokwandisa ukusebenza kakuhle kokupakisha.

Ukuchaneka: I-die bonder ixhotyiswe ngenkqubo ebonakalayo ehamba phambili kunye nenkqubo yokunyakaza, enokufikelela kwi-positioning die bonding imisebenzi. Ngokubeka indawo echanekileyo yenkqubo yokubonwayo, inkqubo yokunyakaza iqinisekisa ukuba intloko ye-die bonding ihamba ngokuchanekileyo kwindawo echaziweyo, ukuze i-chip ye-LED ifakwe ngokuchanekileyo kwi-motherboard.

Iqondo eliphezulu lokuzisebenzela: i-ASM AD832i die bonding machine inezinga eliphezulu lokuzisebenzela, elinciphisa ukungenelela kwezandla, linciphisa iindleko zabasebenzi, kwaye linciphisa ukuba nokwenzeka kwempazamo yomntu.

Imisebenzi

Inkqubo yomthombo wokukhanya: Umatshini we-ASM AD832i wokufa uxhotyiswe ngenkqubo yomthombo wokukhanya ophuculweyo onokubonelela ngokukhanya okwaneleyo kunye nokufana ukuze kuqinisekiswe ukuba i-chip ibonakala ngokucacileyo ngexesha lenkqubo yokufa.

Inkqubo yokunyakaza: Inkqubo yayo yokunyakaza yenzelwe ngokuchanekileyo kwaye iyakwazi ukuhambisa ngokukhawuleza kunye ngokuchanekileyo intloko ye-die bonding kwindawo echaziweyo ukuqinisekisa ukuba i-chip inokulungiswa ngokuchanekileyo kwi-motherboard.

Inkqubo yeVisual: Ngenkqubo yombono wesikhundla, i-ASM AD832i inokufikelela kwindawo echanekileyo ye-chip ukuqinisekisa ukuchaneka komsebenzi ngamnye wokudibanisa ukufa.

Inkqubo yokudibanisa i-die: Inkqubo yokudibanisa i-die inoxanduva lokulungisa i-chip kwi-chip ukuqinisekisa isantya kunye nokuzinza kwe-chip.