BESI The Bonder Machine Datacon 8800

Iingenelo zeDatacon 8800 zibonakaliswa ikakhulu kumandla okuvelisa asebenzayo, ukuguquguquka kunye nokuchaneka. Umthamo wokuvelisa i-Datacon 8800 inemveliso ephezulu kakhulu kwaye inokuphucula kakhulu isantya semveliso. Ngokomzekelo, imodeli yayo ye-Datacon 8800 TCadvanced isebenza kakuhle kwizicelo ze-TSV kwaye inozinzo olungenakulinganiswa lwemveliso. Ukongeza, imodeli yeDatacon 8800 FC imodeli ye-chip mounter yenkqubo yokusebenza isekwe kwiLinux kwaye inokufikelela kwi-10,000 UPH (imveliso ngeyure), ibonise ngakumbi iingenelo zayo kumthamo wemveliso. Ukuguquguquka kunye nokuchaneka kwe-Datacon 8800 nayo igqwesile ngokuguquguquka. Intloko yayo yokudibanisa isekela ukusebenza kwe-7-axis, enokubonelela ngokuguquguquka okuphezulu kunye nokuchaneka kwiindawo eziyinkimbinkimbi zokuvelisa. Ukongezelela, imodeli ye-Datacon 8800 TCadvanced isekela iindlela ezahlukeneyo zokulawula inkqubo, ezinokuthi zilungelelanise iimfuno ezahlukeneyo zokuvelisa kunye nokuqinisekisa ukuzinza nokuthembeka kwenkqubo yokuvelisa. Ngokumalunga nokuguquguquka, i-Datacon 8800 TCadvanced ixhasa i-FO-WLP (i-Wafer-Level Fan-Out Packaging) iteknoloji, efanelekileyo kwiinkqubo ezahlukeneyo zokuxhoma i-chip kunye nokuxhasa zombini iindlela zokuyila ubuso-phantsi kunye nobuso-up, iphucula ngakumbi ukuguquguquka kwayo izicelo eziphathekayo