ASM die bonding izixhobo AD838L plus

Izinto eziluncedo kunye nemisebenzi ye-ASM die bonder AD838L idibanisa ikakhulu le miba ilandelayo:

Imveliso kunye nokusebenza kakuhle: I-AD838L kunye ne-high-precision die bonding capabilities, kunye nokuchaneka kwendawo ye-±15μm (3σ), kwaye inokusingatha ii-chips ezinobungakanani obuhlukeneyo, ukusuka kwi-0.32 ukuya kwi-intshi ye-0.34 (8.13 ukuya kwi-8.64 mm)

Umthamo wayo wokuqhuba uyasebenza kakhulu, unengalo enye ekwaziyo ukuphatha izinto eziya kuthi ga kwi-12,000.

Ukuguquguquka kunye nokuguquguquka: I-die bonder yenzelwe ukuba ibe bhetyebhetye kwaye inokusingatha ii-motherboards zobukhulu obahlukeneyo kunye neemilo, ezinobukhulu obuphambili ukusuka kwi-100 mm ububanzi x 300mm ubude, ukusuka kwi-0.1 ukuya kwi-3.0mm

Ukongeza, ikwaxhasa ukondla okubuyela umva, okufanelekileyo kwiimveliso zokupakisha ezininzi

Itekhnoloji ephucukileyo kunye nobuhlobo bomsebenzisi: I-AD838L plus ixhotyiswe nge-lens ejonge phezulu kunye noyilo lwentloko ye-welding enelungelo elilodwa lomenzi, ibonelela ngeziphumo eziguquguqukayo zesitulo esinamavili kunye nokusebenza okuzinzileyo kwe-welding.

Ujongano lwayo olusebenziseka lula lulula ukusebenza kwaye lufanelekile kwiindawo ezahlukeneyo zemveliso

Ukuzikhethela kunye ne-scalable: I-die bonder ineendlela ezahlukeneyo zokuzikhethela, kubandakanywa inkqubo yokutya, inkqubo yokuhambisa kabini, inkqubo yentloko ye-welding, njl., enokulawulwa ngokuzimeleyo kwaye ilungele iintlobo ezahlukeneyo zeglue kunye neemfuno zokuphatha i-chip.

Ukongeza, ikwaxhasa inkqubo yokunikezela kabini ukubonelela ngokuhambelana okuphezulu kunye nokuguquguquka.

Uluhlu olubanzi lwezicelo : I-AD838L plus ifanelekile kwiimeko ezahlukeneyo zesicelo, kubandakanywa iimodyuli ze-optical, i-optical device bonding, njl.

Izakhono zayo zokuxinana okuphezulu kwesakhelo kunye noyilo lwentloko ye-welding ye-welding yenza kakuhle ekuphatheni iichips ezincinci