ASM die bonding equipment AD838L plus

The advantages and functions of the ASM die bonder AD838L plus mainly include the following aspects‌‌:

‌Productivity and high efficiency‌‌: The AD838L plus has high-precision die bonding capabilities, with a position accuracy of ±15μm (3σ), and can handle chips of various sizes, from 0.32 to 0.34 inches (8.13 to 8.64 mm)‌

Its processing capacity is also very efficient, with a single arm capable of handling up to 12,000 components‌

‌Flexibility and versatility‌‌: The die bonder is designed to be flexible and can handle motherboards of various sizes and shapes, with the main sizes ranging from 100 mm wide x 300mm long, ranging from 0.1 to 3.0mm ‌

In addition, it also supports reverse feeding, which is suitable for multi-chip packaging products ‌

‌Advanced technology and user-friendliness‌‌: AD838L plus is equipped with an upward-looking lens and a patented welding head design, providing high wheelchair dynamic effects and stable welding performance ‌‌

Its user-friendly interface is simple to operate and suitable for various production environments ‌

‌Optional and scalable‌: The die bonder has a variety of optional systems, including a feeding system, a dual dispensing system, a welding head system, etc., which can be independently controlled and suitable for different types of glue and chip handling requirements ‌

In addition, it also supports a dual dispensing system to provide higher dispensing consistency and flexibility ‌‌

‌Wide range of applications ‌‌: AD838L plus is suitable for a variety of application scenarios, including optical modules, optical device bonding, etc. ‌

Its high-density frame processing capabilities and patented welding head design perform well in handling small chips