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Semiconductor equipment

Semiconductor Equipment - Page3

Semiconductor machine

The main function of packaging equipment is to cut and seal the wafers after production and processing, and then process them into finished chips. The packaging process includes wafer thinning, wafer cutting, chip mounting, welding bonding, plastic sealing process, post-curing process, testing, marking process (electroplating, bending, laser printing), packaging, warehouse inspection, shipping and other processes. The role of packaging is to protect chip performance, reduce technical difficulty, and improve product performance and yield rate.

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Semiconductor equipment FAQ

  • asm wire Bonder machine ab550

    asm wire Bonder machine ab550

    The workbench design makes welding faster, more accurate and more stable‌.

  • asm wire Bonding machine Eagle Aero Reel to Reel‌

    asm wire Bonding machine Eagle Aero Reel to Reel‌

    The sensor detects the position and angle of the chip or substrate and transmits the data to the laser generator ‌.

  • ASM Laser Cutting Machine LS100-2‌

    ASM Laser Cutting Machine LS100-2‌

    The advantages of the ASM laser cutting machine LS100-2 mainly include high precision, high efficiency and strong adaptability. ‌

  • ASM laser cutting machine LASER1205

    ASM laser cutting machine LASER1205

    Operating speed ‌: The equipment has a fast moving speed of 100m/min.

  • ASM LED packaging machine IDEALab 3G

    ASM LED packaging machine IDEALab 3G

    Single-beer configuration‌: The equipment provides two optional configurations of 120T and 170T, suitable for different production needs‌

  • besi molding line ams-x

    besi molding line ams-x

    BESI's AMS-X mold machine is an advanced servo hydraulic molding machine with many advantages and features

  • besi molding system MMS-X

    besi molding system MMS-X

    BESI's MMS-X mold machine is a manual version of the AMS-X mold machine‌. It uses a newly developed plate press with an extremely compact and rigid structure to obtain a perfect, flash-free end p...

  • Fico Molding machine FML

    Fico Molding machine FML

    The FML function of the BESI molding machine is mainly used for precise control and management during the packaging and electroplating process.

  • Fico Molding line AMS-LM

    Fico Molding line AMS-LM

    The main function of BESI’s AMS-LM machine is to process large substrates and provide high productivity and good performance and output‌. The machine is capable of processing 102 x 280 mm substrates a

  • fico molding system AMS-i

    fico molding system AMS-i

    AMS-i in fico molding machine is an automated assembly and test system produced by fico. fico is a semiconductor and microelectronics manufacturing equipment company headquartered in the Netherlands.

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