asm siplace x3s smt chip mounter

Siemens X3S SMT (SIPLACE X3S) is a stable and versatile machine with the following advantages and specifications‌:

Advantages

‌Versatility‌: The X3S SMT has three cantilevers and can mount components ranging from 01005 to 50x40mm, meeting the needs of small batch and multi-variety production‌

‌High precision‌: The placement accuracy reaches ±41 microns (3σ), and the angular accuracy is ±0.4° (C&P) to ±0.2° (P&P), ensuring high-precision placement effects‌

‌High efficiency‌: The theoretical speed can reach 127,875 components per hour, the IPC speed is 78,100cph, and the SIPLACE benchmark evaluation speed is 94,500cph‌

‌Flexible feeding system‌: Supports a variety of feeder modules, including SIPLACE component carts, matrix tray feeders (MTC), waffle trays (WPC), etc. Ensure efficient feeding ‌

‌Smart maintenance‌: Professional maintenance contracts ensure that the equipment provides the specified performance and accuracy throughout its entire life cycle ‌

Specifications ‌Machine size‌: 1.9x2.3 meters ‌

‌Placement head features‌: MultiStar technology ‌

‌Component range‌: 01005 to 50x40mm ‌

‌Placement accuracy‌: ±41 micron/3σ (C&P) to ±34 micron/3σ (P&P) ‌

‌Angular accuracy‌: ±0.4°/3σ (C&P) to ±0.2°/3σ (P&P) ‌

‌Maximum component height‌: 11.5 mm ‌

‌Placement force‌: 1.0-10 Newton ‌

‌Conveyor type‌: Single track, flexible dual track ‌

‌Conveyor mode‌: Asynchronous, synchronous, independent placement mode (X4i S) ‌

‌PCB format‌: 50x50mm to 850x560mm‌

‌PCB thickness‌: 0.3-4.5mm (other sizes available on request)‌

‌PCB weight‌: max. 3 kg‌

‌Feeder capacity‌: 160 8mm feeder modules‌