ersa reflow oven machine Hotflow 3/26

ERSA Hotflow-3/26 is a reflow oven produced by ERSA, designed for lead-free applications and mass production. The following is a detailed introduction of the product:

Features and Advantages

Powerful heat transfer and heat recovery capabilities: Hotflow-3/26 is equipped with multi-point nozzles and a long heating zone, which is suitable for soldering large heat capacity circuit boards. This design can effectively increase the efficiency of heat conduction and improve the thermal compensation capability of the reflow oven.

Multiple cooling configurations: The reflow oven provides a variety of cooling solutions such as air cooling, ordinary water cooling, enhanced water cooling, and super water cooling. The maximum cooling capacity can reach 10 degrees Celsius/second to meet the cooling needs of different circuit boards and avoid misjudgment caused by excessive board temperature.

Multi-level flux management system: Supports a variety of flux management methods, including water-cooled flux management, medical stone condensation + adsorption, and flux interception in specific temperature zones, which facilitates equipment maintenance.

‌Full hot air system‌: The heating section adopts a multi-point nozzle full hot air system to effectively prevent the displacement and deflection of small components and avoid temperature interference between different temperature zones‌.

‌ Shockproof design, stable track ‌: The track adopts a full-length shockproof design to ensure stability during the welding process, prevent the solder joints from being disturbed, and ensure the welding quality ‌.

‌The principle of ERSA Hotflow-3/26 ‌ mainly includes its heating and cooling mechanism, heat transfer design, and its application scenarios.

Heating and cooling mechanism ERSA Hotflow-3/26 adopts a variety of cooling configurations, including air cooling, ordinary water cooling, enhanced water cooling, and super water cooling to meet the cooling needs of different circuit boards. Its cooling capacity can reach up to 10 degrees Celsius/second, which effectively prevents the post-furnace AOI misjudgment caused by the high temperature of the PCB board ‌. In addition, Hotflow-3/26 is also equipped with a switchable internal/external cooling device to further optimize the cooling effect ‌

Application scenario ‌Hotflow-3/26 reflow oven is widely used in emerging industries such as 5G communications and new energy vehicles. With the development of these industries, the thickness, number of layers, and heat capacity of PCBs continue to increase. With its powerful heat transfer capacity and multiple cooling configurations, Hotflow-3/26 has become an ideal choice for reflow soldering of large heat capacity circuit boards ‌. ‌