Ekra X5 smt stencil printer

‌EKRA X5 is a high-performance printer that is particularly suitable for processing small, complex and odd-shaped substrates or SiP (System-in-Package) module solutions. It uses the patented Optilign multi-substrate alignment technology, which can manage up to 50 individual substrates in a single fixture, significantly improving production efficiency and throughput. ‌

The main features of EKRA X5 include high flexibility and excellent throughput. It uses the patented Optilign multi-substrate alignment technology, which can handle small, complex and odd-shaped substrates or SiP (System-in-Package) module solutions, ensuring high precision and efficient production. In addition, X5 has the following specific features:

High flexibility and multi-substrate handling capabilities: X5 is able to manage up to 50 individual substrates in one fixture, significantly improving production efficiency and flexibility.

Reduced cleaning cycle: Since the cleaning cycle depends on the number of prints, X5's Optilign technology reduces the number of wipes. Each wipe is equivalent to processing the previous N substrates, thereby reducing downtime.

Multi-carrier capability: The Optilign Multi-carrier capability allows more substrates to be processed in one operation, increasing throughput by nearly 3 times without having to change to a larger carrier. [I/O system upgrade and stability.

‌High-speed servo vision drive system‌: Adopting a high-speed servo vision drive system, the system temperature gradient is reduced and process stability is maintained‌.

The main features and benefits of the EKRA X5 include:

‌High flexibility and throughput‌: The X5 Professional Optilign is designed to achieve the highest flexibility and excellent throughput, capable of handling a variety of complex components and substrates‌.

‌Optilign accuracy‌: Its Optilign technology combines the accuracy of optical alignment with the maximum available printing specifications to ensure high-precision printing results‌.

‌Multi-carrier capability‌: The Optilign Multi-Carrier function allows different sizes of carriers to be used in the same system, further improving production efficiency and throughput‌.

‌Wide range of applications‌: Suitable for a variety of substrates or module solutions with miniaturized, complex and special-shaped designs, suitable for the manufacture of electronic products‌