TOP Quality ASM Siplace X4S Pick and Place Equipment Flexible Dual Railiemens Siplace X4 Pick And Pl
Welcome enquiryTOP Quality ASM Siplace X4S Pick and Place Equipment Flexible Dual Rail
iemens Siplace X4 Pick And Place Machine
Siemens Siplace Pick And Place Machine
Siemens Pick And Place Machine
Siemens Pick and Place Machine
Patch speed:120000CPH
Dimension:1900×2734
Weight: 3460kg
Product description: Siemens Siplace X4 Pick And Place Machine-4 rotary IC head 120000CPH 120000USD ONLY!
| QTY | 4 |
| IPC Speeds | 105,000 cph |
| SIPLACE based test | 125,000 cph |
| Theoretical speed: | 170,500 cph |
| Machine size: | LxWxH:1.9x2.3x1.45*m |
| Mounting head features: | MultiStar |
| Component range: | 01005-50x40mm |
| Mounting Precision: | ±41μm/3σ(C&P)~±34μm/3σ(P&P |
| Angular Precision: | ±0.4°/3σ(C&P)~±0.2°/3σ(P&P) |
| Max Component height: | 11.5mm |
| Mounting pressure: | 1,0-10N |
| Transport type | Flexible dual rail transmission |
| Transport mode | Asynchronous, synchronous, independent mounting |
| PCB Format: | Flexible dual rail transmission |
| In single lane mode can be carried out dual lane transport. | |
| PCB thickness: | 0.3mm-4.5mm |
| PCB size: | 50*50mm~610*510mmo |
| PCB Weight: | Max 3.0kg |
| Feeder capacity: | 160个8X |
Siemens Siplace X4 Pick And Place Machine-4 rotary IC head 120000CPH 120000USD ONLY!
SIPLACE X-Series: A leader in the market
The new Siemens Mounter X4 SIPLACE X4 S provides an ideal solution for demanding mass production needs, meeting the stringent requirements of large-scale manufacturers for flexibility and quality. The SIPLACE X-Series features a space-saving, streamlined design with record speeds and many other great features and options.
Performance is important, but high-speed platforms must also have the flexibility to keep pace with the times. The SIPLACE X4i S is not only the speed* fast placement machine on the market today, but also the powerful software, service excellence and ** applications of SIPLACE, making the X-Series an ideal solution for your specific requirements.
The X-Series' outstanding features include support for large form factor cards, flexible material setup concepts, SIPLACE imaging systems, multiple transfer and placement modes, and 01005 component placement capabilities. You'll benefit from features such as low dpm, fast new product introduction (NPI) processes, and non-disruptive material set changes in the product category.
If you have doubts about this, we can provide you with a dedicated value analysis to help you dig deeper into the advantages that the SIPLACE X-Series can bring to your production floor. At the same time, you are welcome to compare our products with those of other equipment manufacturers.
SIPLACE MultiStar: the only "full-featured" head
