VI 3D Solder Paste Inspection Equipment PI Series Fixed Glue Detector

VI 3D Solder Paste Inspection Equipment PI Series Fixed Glue Detector

VI 3D solder paste inspection equipment PI Series 1. Automatic programming can be used for new product inspection 2. In addition to solder paste inspection, PIE can also perform fixed glue inspection 3. Automatic pad division can be realized through area area ratio 4. 3D super large image inspection It is easier to judge the problem 5. Through SIGMA analysis technology, offline SPC, embedded SPC to realize real-time program monitoring.

Features of VI 3D Solder Paste Inspection Equipment PI Series:

1. Automatic programming can be used for testing new products

2. In addition to solder paste inspection, PIE can also perform fixative inspection

3. Automatic sub-pads can be realized through the area area ratio

4. 3D super large image inspection makes it easier to judge problems

5. Through SIGMA analysis technology, offline SPC, embedded SPC to realize real-time program monitoring

6. The Z-axis can accurately measure small pads without being affected by board bending deformation; and can ensure its stability and accuracy through substrate correction

7. Multi-frequency, Moore can achieve precise test results in the actual production process

8. High-precision 3D imaging can provide clear bad classification