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The SAKI 3Di-MD2 is a dual-lane model in SAKI’s 3D automated optical inspection range. Its two-lane configuration allows two PCB streams to be handled by the inspection system, making lane layout and board dimensions important considerations when integrating the machine into an existing SMT line.
Unlike inspection based on a flat image alone, 3D AOI combines optical imaging with height measurement. This helps inspection programs evaluate component placement and solder-joint shape using three-dimensional information, which can provide additional evidence when assessing defects that are difficult to distinguish from a two-dimensional image.
The 3Di family offers different optical resolution options, with published 3Di-series specifications listing 7 μm, 12 μm and 18 μm camera configurations for applicable models. The appropriate option depends on the component sizes, inspection detail and throughput requirements of the production process. Exact resolution availability should be confirmed for the individual MD2 unit.
For line integration, verify the MD2’s dual-lane PCB limits, conveyor settings, clearance and software configuration before confirming compatibility. These details can vary with the installed optical unit and machine setup.
विनिर्देशाः
| वस्तु | विनिर्देशः |
|---|---|
| चिह्न | SAKI |
| प्रतिकृति | 3Di-MD2 |
| Equipment Type | 3D automated optical inspection (AOI) |
| Lane Configuration | Dual lane |
| Inspection Method | Optical imaging with 3D height measurement |
| Camera Resolution | Confirm installed configuration |
| PCB आकार परिधि | Confirm exact MD2 configuration |
| Component Height Range | Depends on optical configuration; confirm unit details |
| Conveyor and Clearance | Confirm machine configuration |
| Power Requirements | Confirm machine nameplate and specification sheet |
Configuration Notes
Confirm the camera resolution, supported PCB dimensions and dual-lane operating mode for the supplied machine before publishing final technical specifications or planning installation.
