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AD8312 Plus positioning die bonder combines the advantages of ultra-fast and positioning
The AD420XL die bonder is designed with efficiency in mind and can provide high-speed die bonding solutions
The ASM die bonder SD8312 adopts advanced control systems and mechanical structures
The closed-loop coplanarity (TTV) of the ORCAS manual molding system is less than 20μm, ensuring high-precision laminating effects
high-precision cutting: DFL7341 uses laser invisible cutting technology to form a modified layer only inside the silicon wafer
The DFD6341 uses a unique rotary mechanism, the speed return of the X axis is increased to 1000 mm/s
The system can handle multi-chip and multi-process applications in one machine
The raw materials to be sorted are fed into the feed port of the sorting machine through a conveyor belt or vibrator
The AD280 Plus die bonder has high-precision die bonding capabilities, which can ensure the precise placement of components
Its placement speed reaches 100,000 CPH, and even 200,000 CPH in some configurations
This high-speed performance makes the TX2 placement machine perform well in mass production and can significantly improve production efficiency
The placement speed of the ASM X4S placement machine is very high, with a theoretical speed of 170,500 CPH
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As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
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