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KY8030-3 can meet the 01005 detection speed standard and has high-speed detection capabilities
High efficiency and high-speed placement: AC30-L uses a 30-axis Lightning placement head with a placement rate of up to 30,000cph
The F130AI placement machine has a placement speed of up to 25,900 CPH (25,900 components per minute)
Minimum component: 01005 ~ 55mm(H 15mm)
HYbrid3 placement machine supports a variety of inventory packaging methods, including tape and reel, tube, box and tray
The ASM AD832i die bonder significantly improves production efficiency through its efficient workflow and automated operation
The die bonder is designed to be flexible and can handle motherboards of various sizes and shapes
The equipment has high-precision performance and can achieve precision control of ±7um@3σ and ±1°@3σ
The wire bonder performs well in long-term operation and has high stability, which can ensure the continuity and reliability of the production process
The wire bonding accuracy of this wire bonder reaches ±2 microns
The AB589 wire bonder is a high-efficiency wire bonding equipment produced by ASMPT
The ASMPT AERO CAM series wire bonder is specially designed for camera module packaging
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As a supplier of equipment for the electronics manufacturing industry, Geekvalue offers a range of new and used machines and accessories from renowned brands at very competitive prices.
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