Ukukhangela ngokukhawuleza
I-KY8030-3 inokuhlangabezana nomgangatho we-01005 wokubona isantya kwaye inamandla okubona isantya esiphezulu.
Ukusebenza okuphezulu kunye nokubekwa kwesantya esiphezulu: I-AC30-L isebenzisa intloko yokubeka i-30-axis Lightning enezinga lokubeka ukuya kuthi ga kwi-30,000cph.
Umatshini wokubekwa we-F130AI unesantya sokubeka ukuya kuthi ga kwi-25,900 CPH (amacandelo angama-25,900 ngomzuzu)
Ubuncinane becandelo: 01005 ~ 55mm(H 15mm)
Umatshini wokubekwa kweHYbrid3 uxhasa iindlela ezahlukeneyo zokupakisha izinto, kubandakanya iteyiphu kunye nereel, ityhubhu, ibhokisi kunye netreyi.
I-ASM AD832i die bonder iphucula kakhulu impumelelo yemveliso ngokuqhutywa kwayo okusebenzayo kunye nokusebenza okuzenzekelayo
I-die bonder yenzelwe ukuba ibe bhetyebhetye kwaye inokuphatha ii-motherboards zobukhulu obahlukeneyo kunye neemilo
Isixhobo sisebenza ngokuchaneka okuphezulu kwaye sinokufikelela kulawulo oluchanekileyo lwe-±7um@3σ kunye ±1°@3σ.
I-wire bonder yenza kakuhle ekusebenzeni kwexesha elide kwaye inozinzo oluphezulu, olunokuqinisekisa ukuqhubeka nokuthembeka kwenkqubo yokuvelisa.
Ukuchaneka kwe-wire bonder yale ntambo yocingo ifikelela kwi-± 2 microns
I-AB589 ye-wire bonder sisixhobo sokubopha ucingo oluphezulu oluveliswe yi-ASMPT
I-ASMPT AERO CAM series wire bonder yenzelwe ngokukodwa ukupakishwa kwemodyuli yekhamera
I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo
Inkokeli yesisombululo esinye sokumisa i-chip mounter
Ngathi
Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.
imveliso
umatshini wesmt Izixhobo zeSemiconductor umatshini wepcb Umatshini wokulebula ezinye izixhoboIsisombululo somgca we-SMT
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