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Flexible PCB Printing with SPI Feedback and Automatic Leveling
The Hanwha SP1-W stands out for its combination of printing accuracy, board-size flexibility, and feedback-based process correction. Its automatic print-offset correction uses feedback from solder paste inspection (SPI), helping production teams respond to printing defects instead of relying entirely on manual adjustments.
The machine supports single-lane PCB handling up to 510 × 460 mm. With an optional dual-lane configuration, it can accommodate boards up to 330 × 310 mm and support mixed-model production when integrated into a suitable line layout. Stage auto-leveling is standard, while the stated alignment repeatability is ±12.5 μm at 6σ.
For electronics manufacturers evaluating a used Hanwha SP1-W, the key purchasing considerations are the installed conveyor configuration, supported stencil dimensions, software and inspection-feedback functions, and the machine’s current operating condition. We can help buyers review available machine details against their intended PCB assembly requirements before making a sourcing decision.
Especificaciones técnicas de Hanwha SP1-W
| Parámetro | Especificación |
|---|---|
| Modelo | Hanwha SP1-W |
| Precisión de impresión | ±12,5 μm a 6σ |
| Repetibilidad | ±12μm |
| Tiempo de ciclo de impresión | 5 segundos (sin incluir el tiempo de impresión) |
| Tamaño máximo de PCB (tamaño de la placa de procesamiento) | 510 mm de largo × 460 mm de ancho |
| Tamaño de la plantilla (máx.) | 736 mm × 736 mm |
| Tamaño de la plantilla (estándar) | 350 mm × 250 mm |
| Sistema de visión | Alineación fiducial de doble cámara |
| Sistema de limpieza | Secado/húmedo/aspiración automático |
| Interfaz de control | Pantalla táctil con biblioteca de trabajos |
| Fuente de alimentación | 220 V CA, 50/60 Hz |
| Peso de la máquina | Aproximadamente 1200 kg |
