Imisebenzi yomatshini wokukrola we-laser we-PCB ikakhulu ibandakanya ukumakisha, ukubhalwa kwekhowudi, ukuveliswa kwekhowudi ye-QR kunye neminye imisebenzi kumphezulu we-PCB. Iyakwazi ukuvelisa iibhakhowudi, iikhowudi ze-QR, isicatshulwa, ii-icons, njl., ixhasa iindidi ezahlukeneyo zesiko, kwaye inokudityaniswa nenkqubo ye-MES yezoshishino ukuze ifezekise ukuhanjiswa kwedatha ngokuzenzekelayo kunye nengxelo yolwazi. Umgaqo osebenzayo we-PCB umatshini wokukrola we-laser usekwe kwiteknoloji yokukrola i-laser. Umatshini wokukrola we-laser usebenzisa i-laser ye-high-energy density laser beam ukuze i-irradiate imathiriyeli ye-PCB. Ngokulawula i-trajectory yokuskena kunye noxinano lwamandla ombane welaser, umphezulu wezinto eziphathekayo ufumana iimpendulo ezinjengokunyibilika, ukufunxwa okanye i-oxidation, ngaloo ndlela kwakheka iipateni ezifunekayo kunye neetekisi. Ukuhamba kunye nokugxininisa ubunzulu be-laser beam kunokulawulwa ngokulungelelanisa iiparitha zentloko yokusika i-laser. Umatshini wokukrola we-laser uvame ukuqulunqwa nge-laser, inkqubo ye-optical, inkqubo yokulawula amandla, intloko yokusika i-laser kunye nenkqubo yokuhambisa. I-laser iyona nto ingundoqo, kwaye i-laser ephezulu yamandla eveliswayo igxininise kwaye ibunjwe yinkqubo ye-optical kunye nezenzo kwizinto eziphathekayo ze-PCB. Iimeko zesicelo sobuchwepheshe bokukrola i-laser zibanzi kakhulu, kubandakanya ukuchongwa kwamacandelo e-elektroniki, ukupakishwa kwetshiphu, kunye nokuveliswa kweebhodi zePCB. Kwinkalo ye-elektroniki, itekhnoloji yokukrola i-laser inokubonelela ngokuchongwa okuphezulu kokuchaneka kunye nekhowudi, efanelekileyo kwiimfuno ezahlukeneyo zokucwangcisa ngokuchanekileyo. Ukongeza, itekhnoloji yokukrola i-laser nayo ineengenelo zokuchaneka okuphezulu, ukusebenza kakuhle okuphezulu, ukukhuselwa kwendalo kunye nokonga amandla. Inokuvelisa iipateni ezichanekileyo ezichanekileyo kunye neetekisi ebusweni bezinto ezahlukeneyo kwaye inokumelana ne-corrosion

