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Iimpawu eziphambili kunye noncedo lweCyber AOI isixhobo i-QX600™ ibandakanya le miba ilandelayo:
Ukubonwa kokuchaneka okuphezulu: I-QX600™ ixhotyiswe ngenzwa yokulungiswa okuphezulu (12 μm), enokubonelela ngemifanekiso eqaqambileyo negqibeleleyo ukuze ibone ngokuchanekileyo iziphene ezincinci ezinje nge-01005 kunye neengxaki ezidibeneyo ze-solder.
Udweliso lwenkqubo olusebenzayo kunye nesantya esisezantsi se-alam yobuxoki: I-QX600™ ithatha iteknoloji yembono ye-SAM (Statistical Shape Modeling) kunye neteknoloji ye-AI2 (i-Autonomous Image Interpretation), yenza inkqubo ibe lula kwaye ikhawuleze, ngelixa i-alamu yobuxoki isezantsi kakhulu.
Ukufunyanwa okungadibananga: I-QX600™ isebenzisa itekhnoloji ye-optical ukubona, ngaphandle kokunxibelelana ngokuthe ngqo nento evavanywayo, ukuphepha ubungozi obunokubakho kunye nokukhusela into evavanywayo.
Uluhlu olubanzi lwezicelo: I-QX600™ ilungele iimeko ezahlukeneyo zesicelo, kubandakanya ukubonwa kwesiphene kwi-PCB welding, ukudibanisa kunye neenkqubo zokuprinta, ukuqinisekisa umgangatho wemveliso kunye nokusebenza kakuhle kwemveliso.
Ingxelo yedatha kunye nokulungiswa kwenkqubo: I-QX600™ inokuqokelela inani elikhulu ledatha, kwaye incede iinjineli zichonge iingxaki kwinkqubo yokuvelisa ngokuhlalutya idatha, ukuze kulungiswe inkqubo.
