i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - kwi-Stock & ukulungele ukuThunyelwa

Fumana iQuote →
product
SAKI 3Di-LS3 smt 3d aoi machine

SAKI 3Di-LS3 smt 3d ooi umatshini

I-SAKI 3Di-LS3 sisixhobo sokuhlola i-3D esisebenza ngokuphezulu esizenzekelayo (i-AOI) eyenzelwe ushishino lokuvelisa i-elektroniki ukuze ibone iziphene ze-welding.

Iinkcukacha

I-SAKI 3Di-LS3 sisixhobo sokuhlola i-3D esiphezulu esisebenza ngokuzenzakalelayo (i-AOI) eyenzelwe imboni yokuvelisa i-electronics ukubona iziphene ze-welding (ezifana neesekethe ezimfutshane, i-solder joints, i-offsets, njl.) ngexesha lendibano ye-PCB. Isebenzisa iteknoloji yokuskena i-laser kunye ne-multi-angle imaging optical ukufezekisa ukuchaneka okuphezulu kunye nokuhlolwa kwe-3D ngesantya esiphezulu.

2. Iinkcukacha eziphambili

Iiparamitha zento

Itekhnoloji yokubona Ukuskena kweLaser + i-multi-angle yokubona ngamehlo (umlinganiselo we-3D)

Ukubona izinto PCB solder joints, amacandelo (CHIP, QFP, BGA, njl.)

Ukubona ukuchaneka Isisombululo esithe nkqo: ≤1μm, isisombululo esithe tye: ≤10μm

Isantya sokuskena Ukuya kumashumi amawaka eengongoma zomlinganiselo ngesekhondi (kuxhomekeke kubunzima bePCB)

Ubungakanani bePCB Ubukhulu bebhodi obuxhasiweyo: buqhele ukuya kuthi ga kwi-510mm × 460mm (imifuziselo ethile kufuneka iqinisekiswe)

Inkqubo yokucwangcisa ujongano lomzobo, inkxaso yokungenisa idatha yeCAD, ukuhambelana kwecandelo elizenzekelayo

Unxibelelwano lonxibelelwano Inkxaso ye-SECS/GEM, TCP/IP, edityaniswe nenkqubo ye-MES

3. Imisebenzi engundoqo

Ukufunyanwa kwe-3D ye-solder edibeneyo: Yakha kwakhona iprofayile yokuphakama kwejoyinti ye-solder ngokuskena i-laser, kwaye ubone iziphene ezifana netoti engonelanga, i-tin egqithisileyo, kunye nokubopha ibhulorho.

Ukufunyanwa kwelungu elilahlekileyo / lokulinganisa: Chonga indawo yecandelo, i-polarity, iindawo ezingalunganga, njl.

Ukuhlolwa kwe-multi-angle optical: Dibanisa imifanekiso ye-2D kunye nedatha ye-3D ukuphucula ukulawulwa kwezinga elihle lobuxoki.

Ulawulo lwenkqubo yezibalo (SPC): Ivelisa iingxelo zokuhlola ngexesha langempela, ixhasa ukulandelwa kwedatha kunye nohlalutyo.

I-algorithm yokuhlola i-adaptive: inokufunda i-morphology ye-solder edibeneyo kunye nokunciphisa izinga le-alamu yobuxoki.

4. Izilumkiso zokusebenza

Iimfuno zokusingqongileyo:

Ubushushu: 20±5℃, ukufuma: 30-70% RH, kunqande ukungcangcazela kunye nokukhanya okuthe ngqo.

Ukubekwa kwePCB:

Qinisekisa ukuba i-PCB ithe tyaba kwaye igxininise kumthuthi ukunqanda i-warping echaphazela ukuchaneka kwe-laser scanning.

Ulungelelwaniso kunye nokugcinwa:

Ulungelelwaniso lweLaser kunye nenkqubo yokubona ubude bendlela yokulinganisa ubude iyafuneka kuqalo lwemihla ngemihla.

Ukusebenza okukhuselekileyo:

Musa ukujonga ngokuthe ngqo kumthombo wokukhanya we-laser, kwaye ungavuli isigqubuthelo sokukhusela xa isixhobo sisebenza.

5. Iimpazamo eziqhelekileyo kunye nezisombululo

Impazamo enokwenzeka Unobangela Isisombululo

Umfanekiso we-laser scanning umfiliba. Ilensi ingcolisekile okanye ubude bojoliso bususiwe. Coca ilensi kwaye uhlengahlengise ubude bojoliso.

Izinga le-alam yobuxoki liphezulu kakhulu. Iiparamitha zokubona zisetwe ngokungqongqo kakhulu okanye umthombo wokukhanya awulingani. Lungisa i-threshold parameters kwaye ukhangele ukuhambelana kokukhanya komthombo wokukhanya.

Ukungaphumeleli konxibelelwano (uqhagamshelwano ne-MES luphazamisekile). Impazamo yoqwalaselo lwenethiwekhi okanye ujongano lukhululekile. Jonga intambo yenethiwekhi / useto lwe-IP kwaye uqalise kwakhona inkonzo yonxibelelwano.

Intshukumo engaqhelekanga yengalo yerobhothi. Umzila wesikhokelo ungcolisekile okanye i-motor ayiphumelelanga. Coca isiporo sesikhokelo kwaye uyithambise, kwaye uqhagamshelane emva kokuthengisa ukujonga imoto.

6. Indlela yokugcina

Ulondolozo lwemihla ngemihla:

Coca i-lens optical (ngelaphu elingenathuli + utywala).

Jonga uxinzelelo lomthombo womoya (ukuba kufanelekile).

Ulondolozo lweveki:

Coca umthuthi kunye nomkhondo wokuhambisa ukunqanda ukufumba kothuli.

Lungiselela inzwa yobude belaser.

Ukugcinwa rhoqo (ngekota):

Buyisela imithombo yokukhanya egugayo (efana nemigca yokukhanya ye-LED).

Gcina imilinganiselo yenkqubo kunye neenkqubo zokubona.

7. Imiyalelo eyongezelelweyo

Uphuculo lweSoftware: Kuyacetyiswa ukuba uqhagamshelane nenkxaso yobugcisa be-SAKI rhoqo ukufumana uhlaziyo lwamva nje lwe-algorithm.

Amalungu asecaleni: Iimodyuli zeLaser, iilensi zamehlo, abathwali, njl.njl. kufuneka basebenzise izixhobo zoqobo.

Ukuba ufuna incwadana eneenkcukacha yobugcisa okanye uluhlu lwekhowudi enempazamo, kuyacetyiswa ukuba ubhekisele kumaxwebhu asemthethweni akwa-SAKI okanye uqhagamshelane nomnikezeli wenkonzo ogunyazisiweyo.

2.SAKI 3D AOi 3Di-LS3(L size)

Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?

Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukuqalwa kweTshayina ngetekhnoloji yokusika. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".

Iinkcukacha
GEEKVALUE

I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo

Inkokeli yesisombululo esinye sokumisa i-chip mounter

Ngathi

Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.

Idilesi yoqhagamshelwano:No. 18, Shangliao Industrial Road, Shajing Town, Baoan District, Shenzhen, China

Inombolo yefowuni yokubonisana:+86 13823218491

I-imeyile:smt-sales9@gdxinling.cn

QHAGAMSHELANA NATHI

© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS

kfweixin

Skena ukongeza i-WeChat