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SAKI 3Di-LS3 smt 3d aoi machine

SAKI 3Di-LS3 smt 3d ooi umatshini

I-SAKI 3Di-LS3 sisixhobo sokuhlola i-3D esisebenza ngokuphezulu esizenzekelayo (i-AOI) eyenzelwe ushishino lokuvelisa i-elektroniki ukuze ibone iziphene ze-welding.

Iinkcukacha

I-SAKI 3Di-LS3 sisixhobo sokuhlola i-3D esiphezulu esisebenza ngokuzenzakalelayo (i-AOI) eyenzelwe imboni yokuvelisa i-electronics ukubona iziphene ze-welding (ezifana neesekethe ezimfutshane, i-solder joints, i-offsets, njl.) ngexesha lendibano ye-PCB. Isebenzisa iteknoloji yokuskena i-laser kunye ne-multi-angle imaging optical ukufezekisa ukuchaneka okuphezulu kunye nokuhlolwa kwe-3D ngesantya esiphezulu.

2. Iinkcukacha eziphambili

Iiparamitha zento

Itekhnoloji yokubona Ukuskena kweLaser + i-multi-angle yokubona ngamehlo (umlinganiselo we-3D)

Ukubona izinto PCB solder joints, amacandelo (CHIP, QFP, BGA, njl.)

Ukubona ukuchaneka Isisombululo esithe nkqo: ≤1μm, isisombululo esithe tye: ≤10μm

Isantya sokuskena Ukuya kumashumi amawaka eengongoma zomlinganiselo ngesekhondi (kuxhomekeke kubunzima bePCB)

Ubungakanani bePCB Ubukhulu bebhodi obuxhasiweyo: buqhele ukuya kuthi ga kwi-510mm × 460mm (imifuziselo ethile kufuneka iqinisekiswe)

Inkqubo yokucwangcisa ujongano lomzobo, inkxaso yokungenisa idatha yeCAD, ukuhambelana kwecandelo elizenzekelayo

Unxibelelwano lonxibelelwano Inkxaso ye-SECS/GEM, TCP/IP, edityaniswe nenkqubo ye-MES

3. Imisebenzi engundoqo

Ukufunyanwa kwe-3D ye-solder edibeneyo: Yakha kwakhona iprofayile yokuphakama kwejoyinti ye-solder ngokuskena i-laser, kwaye ubone iziphene ezifana netoti engonelanga, i-tin egqithisileyo, kunye nokubopha ibhulorho.

Ukufunyanwa kwelungu elilahlekileyo / lokulinganisa: Chonga indawo yecandelo, i-polarity, iindawo ezingalunganga, njl.

Ukuhlolwa kwe-multi-angle optical: Dibanisa imifanekiso ye-2D kunye nedatha ye-3D ukuphucula ukulawulwa kwezinga elihle lobuxoki.

Ulawulo lwenkqubo yezibalo (SPC): Ivelisa iingxelo zokuhlola ngexesha langempela, ixhasa ukulandelwa kwedatha kunye nohlalutyo.

I-algorithm yokuhlola i-adaptive: inokufunda i-morphology ye-solder edibeneyo kunye nokunciphisa izinga le-alamu yobuxoki.

4. Izilumkiso zokusebenza

Iimfuno zokusingqongileyo:

Ubushushu: 20±5℃, ukufuma: 30-70% RH, kunqande ukungcangcazela kunye nokukhanya okuthe ngqo.

Ukubekwa kwePCB:

Qinisekisa ukuba i-PCB ithe tyaba kwaye igxininise kumthuthi ukunqanda i-warping echaphazela ukuchaneka kwe-laser scanning.

Ulungelelwaniso kunye nokugcinwa:

Ulungelelwaniso lweLaser kunye nenkqubo yokubona ubude bendlela yokulinganisa ubude iyafuneka kuqalo lwemihla ngemihla.

Ukusebenza okukhuselekileyo:

Musa ukujonga ngokuthe ngqo kumthombo wokukhanya we-laser, kwaye ungavuli isigqubuthelo sokukhusela xa isixhobo sisebenza.

5. Iimpazamo eziqhelekileyo kunye nezisombululo

Impazamo enokwenzeka Unobangela Isisombululo

Umfanekiso we-laser scanning umfiliba. Ilensi ingcolisekile okanye ubude bojoliso bususiwe. Coca ilensi kwaye uhlengahlengise ubude bojoliso.

Izinga le-alam yobuxoki liphezulu kakhulu. Iiparamitha zokubona zisetwe ngokungqongqo kakhulu okanye umthombo wokukhanya awulingani. Lungisa i-threshold parameters kwaye ukhangele ukuhambelana kokukhanya komthombo wokukhanya.

Ukungaphumeleli konxibelelwano (uqhagamshelwano ne-MES luphazamisekile). Impazamo yoqwalaselo lwenethiwekhi okanye ujongano lukhululekile. Jonga intambo yenethiwekhi / useto lwe-IP kwaye uqalise kwakhona inkonzo yonxibelelwano.

Intshukumo engaqhelekanga yengalo yerobhothi. Umzila wesikhokelo ungcolisekile okanye i-motor ayiphumelelanga. Coca isiporo sesikhokelo kwaye uyithambise, kwaye uqhagamshelane emva kokuthengisa ukujonga imoto.

6. Indlela yokugcina

Ulondolozo lwemihla ngemihla:

Coca i-lens optical (ngelaphu elingenathuli + utywala).

Jonga uxinzelelo lomthombo womoya (ukuba kufanelekile).

Ulondolozo lweveki:

Coca umthuthi kunye nomkhondo wokuhambisa ukunqanda ukufumba kothuli.

Lungiselela inzwa yobude belaser.

Ukugcinwa rhoqo (ngekota):

Buyisela imithombo yokukhanya egugayo (efana nemigca yokukhanya ye-LED).

Gcina imilinganiselo yenkqubo kunye neenkqubo zokubona.

7. Imiyalelo eyongezelelweyo

Uphuculo lweSoftware: Kuyacetyiswa ukuba uqhagamshelane nenkxaso yobugcisa be-SAKI rhoqo ukufumana uhlaziyo lwamva nje lwe-algorithm.

Amalungu asecaleni: Iimodyuli zeLaser, iilensi zamehlo, abathwali, njl.njl. kufuneka basebenzise izixhobo zoqobo.

Ukuba ufuna incwadana eneenkcukacha yobugcisa okanye uluhlu lwekhowudi enempazamo, kuyacetyiswa ukuba ubhekisele kumaxwebhu asemthethweni akwa-SAKI okanye uqhagamshelane nomnikezeli wenkonzo ogunyazisiweyo.

2.SAKI 3D AOi 3Di-LS3(L size)

GEEKVALUE

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Inkokeli yesisombululo esinye sokumisa i-chip mounter

Ngathi

Njengomthengisi wezixhobo kushishino lokwenziwa kombane, iGeekvalue ibonelela ngoluhlu loomatshini abatsha nabasele besetyenzisiwe kunye nezixhobo ezisuka kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.

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