SAKI 2d aoi smt Umatshini woHlolo oluSebenzayo oluSebenzayo lwe-BF-LU1

I-SAKI BF-LU1 sisixhobo sokuhlola i-optical optical esisebenza ngokuphezulu esinamacala amabini (AOI) esizinikele ekuhloleni umgangatho we-PCB (ibhodi yesekethe eprintiweyo) kwi-SMT (i-surface mount technology) imigca yokuvelisa. Isixhobo sisebenzisa i-high-resolution optical imaging + AI intelligent algorithm ukuchonga ngokukhawuleza iingxaki ezifana ne-solder joint defects, iinxalenye ezingekhoyo, iinxalenye ezingalunganga, kunye neempazamo ze-polarity ukuqinisekisa ulawulo lomgangatho wenkqubo yokuhlanganisa i-elektroniki.

2. Iinkcukacha eziphambili

IParameter yento

Itekhnoloji yokufumanisa Isisombululo esiphakamileyo somfanekiso wombala onamacala amabini (umthombo wokukhanya we-LED oneengile ezininzi)

Ukubona into PCB solder joints (solder paste, BGA, QFP, njalo njalo), amacandelo SMD (resistors, capacitors, ICs, njl.)

Isisombululo se-Optical Ukuya kuthi ga kwi-10μm/pixel (kuxhomekeke kuqwalaselo lwelensi)

Isantya sokubona 500 ~ 2000 amacandelo/iyure (kuxhomekeke kubunzima bePCB)

Ubungakanani obukhulu bePCB 510mm × 460mm (imodeli eqhelekileyo)

Inkqubo yomthombo wokukhanya Imibala emininzi ye-LED yeringi yomthombo wokukhanya (obomvu / oluhlaza / oluhlaza okwesibhakabhaka / omhlophe, i-engile ehlengahlengiswayo kunye nokukhanya)

Umsebenzi weSoftware Inkxaso yokungenisa idatha ye-CAD, ukuhambelana kwecandelo elizenzekelayo, uhlalutyo lwedatha ye-SPC, unxibelelwano lwe-MES

I-interface yonxibelelwano ye-SECS / i-GEM, i-TCP / IP, ukuhlanganiswa kwenkxaso kunye nenkqubo ye-MES / PLC

3. Iimpawu eziphambili

(1) Ukuchaneka okuphezulu kwe-optical imaging

Yamkela ikhamera yeCCD ene-high-resolution ene-multi-angle ye-LED yomthombo wokukhanya ukuze uqinisekise umfanekiso ocacileyo we-solder joints kunye namacandelo.

Ixhasa ukukhanya okubomvu, okuluhlaza, okuluhlaza okwesibhakabhaka kunye nomhlophe ukudibanisa ukunyusa ukungafani kwezinto ezahlukeneyo (ezifana ne-solder kunye neplastiki).

(2) I-algorithm yokufumanisa ehlakaniphile

Ngokusekwe kumatshini we-AI wokufunda, chonga ngokuzenzekelayo iziphene ezidityanisiweyo ze-solder (i-tin ephantsi, i-tin ephezulu, ibhulorho, i-solder ebandayo, njl.).

(3) Inkqubo eguquguqukayo kunye ne-automation

Inkxaso yokungenisa ifayile ye-CAD, yenza ngokuzenzekelayo iinkqubo zokubona, kwaye unciphise ixesha lokuseta ngesandla.

(4) Ukuhlanganiswa kwemveliso ngokufanelekileyo

Inokudityaniswa nomatshini wokubekwa kwe-SMT, i-reflow soldering, kunye nenkqubo ye-MES ukufezekisa ingxelo yesiphene ngexesha langempela kunye nokuhlelwa ngokuzenzekelayo.

4. Imisebenzi ephambili

(1) Ukufunyanwa kwe-solder joint

Ukubhaqwa koshicilelo lwe-Solder paste (i-tin ephantsi, i-tin ephezulu, i-offset, ibhulorho).

I-BGA / QFN yokufunyanwa kwe-solder edibeneyo (i-solder ebanda edibeneyo, ibhola elahlekileyo, i-offset).

(2) Ukufunyanwa kwecandelo

Izinto ezingekhoyo, iindawo ezingalunganga, i-polarity ebuyela umva, i-offset, isikhumbuzo.

(3) Ulawulo lwedatha

Ukugcinwa kweziphumo zokubona, uhlalutyo lwe-SPC, kunye nokuthunyelwa kwedatha ye-NG / OK.

Inkxaso yokuskena ibhakhowudi ukuphumeza ukulandeleka kwePCB.

(4) Uqhagamshelwano lwemveliso

Nxibelelana nenkqubo ye-MES ukuphumeza ukuhlenga-hlengisa okuzenzekelayo okanye ukuvala i-alam.

5. Izilumkiso zokusebenza

(1) Iimfuno zokusingqongileyo

Ubushushu: 15 ~ 30 ℃ | Ukufuma: 30 ~ 70% RH

(2) Ukubekwa kwePCB

Qinisekisa ukuba i-PCB ithe tyaba kwaye ilungisiwe ukunqanda i-warping echaphazela umfanekiso.

Umzila wokuhambisa kufuneka ugcinwe ucocekile ukuthintela ukuxinana.

(3) Ukulungiswa komthombo wokukhanya

Jonga ukufana komthombo wokukhanya xa uqala umatshini yonke imihla, kwaye wenze ulungelelwaniso lwebhalansi emhlophe ukuba kuyimfuneko.

(4) Useto lweSoftware

Khetha itemplate yokuhlola ezinikeleyo ngokohlobo lwecandelo (BGA, CHIP, njl.) kunye nokwandisa iiparamitha zokuhlola.

(5) Ukusebenza ngokukhuselekileyo

Akuvumelekanga ukuhlengahlengisa ugxininiso lwekhamera xa uthanda, kwaye kufuneka iqhutywe ngabasebenzi abaqeqeshiweyo.

6. Iimpazamo eziqhelekileyo kunye nezisombululo

Impazamo enokwenzeka Unobangela Isisombululo

Umfanekiso omfiliba/ukukhanya okungalinganiyo Ungcoliseko lweLens/ukwaluphala komthombo wokukhanya/ugxininiso lokucoca Coca ilensi, buyisela umthombo wokukhanya, kwaye uhlengahlengise ugxininiso.

Iqondo le-alam lobuxoki liphezulu kakhulu Uvavanyo lwethreshold lumiselwe ngqongqo kakhulu/i-engile yomthombo wokukhanya ayifaneleki Lungiselela iiparamitha ze-algorithm kwaye ulungelelanise i-engile yomthombo wokukhanya.

Umkhondo wokuhambisa ubambekile Izinto zangaphandle kwingoma / ukungaphumeleli kwenzwa Coca umkhondo kwaye ujonge inzwa yefoto yombane

Ukuwa kweSoftware/akukho mpendulo Inkumbulo enganelanga/ungquzulwano lwenkqubo Qala kwakhona isoftwe, khulula inkumbulo, kwaye uhlaziye inguqulelo

Ukusilela koNxibelelwano (MES/PLC) Ukukhulula intambo yenethiwekhi/impazamo yoqwalaselo lweprothokholi Jonga uqhagamshelo lwenethiwekhi kwaye uphinde uqwalasele iprotocol yonxibelelwano

7. Indlela yokugcina

(1) Ukugcinwa kwemihla ngemihla

Coca ilensi kunye nomthombo wokukhanya (sebenzisa ilaphu elingenathuli + notywala).

Jonga ukuba umzila wothumelo ugudile kwaye ususe intsalela ye-tin slag.

(2) Ukugcinwa kweveki

Ukulinganisa ukukhanya kunye nokulinganisela okumhlophe.

Gcina inkqubo yobhaqo kunye neeparamitha zenkqubo.

(3) Ukugcinwa kwenyanga/kwekota

Jonga ukuba izikrufu zokulungisa ikhamera zikhululekile.

Coca okanye ubuyisele isihluzo sobubushushu