I-SAKI 3D AOI SMT Umatshini woHlolo oluSebenzayo oluSebenzayo lwe-3Di MD2

I-SAKI 3Di MD2 sisixhobo sokuhlola okuzenzekelayo se-3D esisebenza ngokukhawuleza (AOI) esasungulwa ngu-SAKI waseJapan. Yenzelwe ukuveliswa kwe-elektroniki yanamhlanje kwaye isetyenziselwa ukuhlolwa komgangatho ophezulu ngexesha lenkqubo yokuhlanganisa iibhodi zeesekethe eziprintiweyo (PCBs).

2. Iinkcukacha eziphambili zobugcisa

Iinkcukacha zehardware

Inkqubo yomfanekiso: Indibaniselwano yekhamera yeCCD ene-engile ezininzi

Inkqubo yomthombo wokukhanya: Umthombo wokukhanya owenziwe ngemibala emininzi ye-LED, ulawulo olucwangcisiweyo

Isisombululo se-Z-axis: ukuya kuthi ga kwinqanaba le-1μm

Isantya sokubona: ukuya kuthi ga kwi-1,200-1,500 iibhodi ngeyure (kuxhomekeke kubungakanani bebhodi kunye nobunzima)

Ubungakanani bebhodi enkulu: 510mm × 460mm (ubukhulu obukhulu bungenziwa ngokwezifiso)

Ubuncinci becandelo: 0201 (0.25mm × 0.125mm) okanye encinci

Uluhlu lokulinganisa ubude: 0-10mm

Ukuchaneka komlinganiselo wobude: ± 5μm

3. Iimpawu eziphambili kunye neenzuzo

1. Ubuchwephesha bokucinga obuphezulu be-3D

I-SAKI 3Di MD2 isebenzisa itekhnoloji yokucinga ye-3D enelungelo elilodwa lomenzi wokufumana ulwazi lobude becandelo ngokudubula kwee-engile ezininzi kunye nomthombo wokukhanya ocwangcisiweyo, kwaye inokulinganisa ngokuchanekileyo umthamo we-solder paste, i-coplanarity yecandelo kunye nomgangatho wokuwelda.

2. Ukufumanisa isantya esiphezulu kunye nokuchaneka okuphezulu

Isixhobo sisebenzisa iindlela eziphuculweyo ze-optical kunye ne-high-speed image processing algorithms ukufezekisa ukufumanisa ngokukhawuleza ngaphandle kokuncama ukuchaneka, ukuhlangabezana neemfuno zemigca yokuvelisa umthamo ophezulu.

3. Ukuqondwa kwesiphene esikrelekrele

I-algorithm eyakhelwe-ngaphakathi ye-AI inokufunda iimpawu ze-welding eziqhelekileyo kwaye zichonge ngokuzenzekelayo iziphene ezahlukeneyo ze-welding ezifana ne-bridging, i-soldering ebandayo, i-tin eyaneleyo, i-tombstones yecandelo, njl., ukunciphisa kakhulu i-alamu yobuxoki.

4. Ukucwangciswa kwenkqubo eguquguqukayo

Iikhamera zesisombululo ezahlukeneyo zinokukhethwa ngokweemfuno zabathengi, kwaye i-angle yokufumanisa okanye ibhodi yokwandisa umthamo wokulungiswa kwebhodi inokunyuswa ukuhlangabezana neemfuno ezahlukeneyo zemveliso.

IV. Amanyathelo okhuseleko okusebenza

1. Ukuvula kunye nokuqalisa

Qinisekisa ukuba izixhobo zibekwe kwinqanaba kunye ne-workbench ezinzile

Jonga zonke iintambo phambi kokuba uvule ukuqinisekisa ukuba zikhuselekile

Emva kokuba inkqubo iqalile, linda ukuba inkqubo yokuzivavanya igqibezele

Yenza ulungelelwaniso rhoqo (kucetyiswa kanye ngeveki okanye njengoko kufunwa yimveliso)

2. Ukusebenza kwemihla ngemihla

Qinisekisa ukuba i-PCB eza kuhlolwa icocekile kwaye ayinathuli ukunqanda ukugwetywa

Khangela ukuba isicwangciso sobubanzi bomzila wokuhambisa siyahambelana nebhodi yePCB

Qinisekisa ukuba inkqubo yokuhlola ikhethwe ngokuchanekileyo

Qwalasela isalathisi somsebenzi wesixhobo

3. Imiqathango yokucwangcisa

Emva kokungenisa idatha yeCAD, qiniseka ukuba ukhangele indawo yecandelo kunye neeparitha

Kumacandelo aphambili, iiparamitha zokuhlola ezingqongqo zinokusetwa

Gcina iinkqubo zokuhlola iimveliso ezahlukeneyo kwaye umisele ithala leencwadi leprogram

V. Ulwazi lwempazamo eqhelekileyo kunye nezisombululo

1. Iingxaki zokufumana umfanekiso

Impazamo: umfanekiso omfiliba okanye ongekhoyo

Izizathu ezinokwenzeka: ungcoliseko lwelensi, umthombo wokukhanya ongaqhelekanga, ukusilela kwekhamera

Isisombululo:

Coca amacandelo okukhanya (sebenzisa izixhobo ezikhethekileyo zokucoca)

Jonga ilungiselelo lokukhanya komthombo wokukhanya

Lungisa kwakhona ikhamera

2. Ukusilela kwenkqubo yokuhambisa

Imeko yokusilela: ibhodi ixingekile okanye usulelo olulambathayo

Izizathu ezinokwenzeka: ukusetwa kobubanzi bomzila obungafanelekanga, ibhanti elikhululekileyo, ukusilela koluvo

Isisombululo:

Lungisa ububanzi bengoma

Jonga kwaye ulungise ukunyanzeliswa kwebhanti

Coca okanye utshintshe inzwa

3. Iziphumo zovavanyo ezingaqhelekanga

Imeko yokungaphumeleli: ukwanda ngokukhawuleza kwesantya se-alamu yobuxoki

Izizathu ezinokwenzeka: utshintsho lweparameter yenkqubo, izicwangciso zeprogram ezingafanelekanga, ukuphazamiseka kokukhanya kwe-ambient

Isisombululo:

Qwalasela eyona parameters yenkqubo

Lungiselela kwakhona inkqubo yovavanyo

Qinisekisa ukukhanya okuzinzileyo malunga nesixhobo

VI. Iindlela zogcino

1. Ulondolozo lwemihla ngemihla

Umsebenzi wokucoca:

Coca umphezulu wezixhobo kunye nomkhondo wokuhambisa yonke imihla

Coca izixhobo zamehlo ngeveki (sebenzisa ikhithi yokucoca ekhethekileyo)

Izinto zokuhlola:

Jonga ukuthanjiswa kwenxalenye nganye ehambayo

Qinisekisa ukuba zonke iziqhoboshi azilahlekanga

Jonga ubume boqhagamshelwano lwentambo

2. Ukugcinwa rhoqo

Ukugcinwa kwenyanga:

Coca ngokupheleleyo inkqubo yamehlo

Jonga ukuhambelana kokukhanya komthombo wokukhanya

Ukugcinwa kwekota:

Tshintsha iindawo zokunxiba (ezifana neebhanti, izihluzi, njl.njl.)

Lungiselela ngokupheleleyo inkqubo

3. Ulondolozo lonyaka lobungcali

Kucetyiswa ukuba ulondolozo lobungcali lwenziwe ziinjineli eziqinisekisiweyo ze-SAKI minyaka le, kubandakanywa:

Ulungelelwaniso oluchanekileyo lwenkqubo ye-Optical

Ukukhangela ukuchaneka kwenkqubo yoomatshini

Inkqubo yesoftware ukuxilongwa ngokubanzi

VII. Iingcebiso zokusebenzisa ukuphuculwa

Ulawulo lokusingqongileyo: Gcina izixhobo zisebenza kwindawo enobushushu obuyi-23±3°C kunye nokufuma kwe-40-70%RH.

Ulawulo lwedatha: Rhoqo uxhasa inkqubo yokubona kunye neeparamitha zenkqubo

Uhlaziyo lweSoftware: Hlaziya rhoqo i-algorithm yokufumanisa kunye nesoftware yenkqubo

Ukuqukumbela

Njengesixhobo esiphambili solawulo lomgangatho wokwenziwa kombane wanamhlanje, ukusebenza okuphezulu kunye nokuthembeka kwenkqubo ye-SAKI 3Di MD2 3D AOI iye yamkelwa ngokubanzi lishishini.