SAKI 3D AOI SMT Automated Optical Inspection machine 3Di MD2

SAKI 3Di MD2 is a high-performance 3D automatic optical inspection (AOI) equipment launched by SAKI of Japan. It is designed for modern electronic manufacturing and is used for high-quality inspection during the assembly process of printed circuit boards (PCBs).

2. Main technical specifications

Hardware specifications

Imaging system: Multi-angle high-resolution CCD camera combination

Light source system: Multi-color LED structured light source, programmable control

Z-axis resolution: up to 1μm level

Detection speed: up to 1,200-1,500 boards per hour (depending on board size and complexity)

Maximum board size: 510mm × 460mm (larger sizes can be customized)

Minimum component size: 0201 (0.25mm × 0.125mm) or smaller

Height measurement range: 0-10mm

Height measurement accuracy: ±5μm

3. Core features and advantages

1. Advanced 3D imaging technology

SAKI 3Di MD2 uses patented 3D imaging technology to obtain component height information through multi-angle shooting and structured light source, and can accurately measure solder paste volume, component coplanarity and welding quality.

2. High-speed and high-precision detection

The equipment uses optimized optical paths and high-speed image processing algorithms to achieve fast detection without sacrificing accuracy, meeting the needs of high-capacity production lines.

3. Intelligent defect recognition

The built-in AI algorithm can learn normal welding characteristics and automatically identify various welding defects such as bridging, cold soldering, insufficient tin, component tombstones, etc., greatly reducing the false alarm rate.

4. Flexible system configuration

Different resolution cameras can be selected according to customer needs, and the detection angle or expansion board processing capacity can be increased to meet diverse production needs.

IV. Operation precautions

1. Power on and initialization

Make sure the equipment is placed on a level and stable workbench

Check all cable connections before powering on to ensure they are secure

After the system starts, wait for the self-test procedure to complete

Perform calibration regularly (recommended once a week or as required by production)

2. Daily operation

Ensure that the PCB to be inspected is clean and dust-free to avoid misjudgment

Check whether the width setting of the conveyor track matches the PCB board

Confirm that the inspection program is correctly selected

Observe the equipment operation status indicator

3. Programming precautions

After importing CAD data, be sure to check the component position and parameters

For key components, more stringent inspection parameters can be set

Save the inspection programs for different products and establish a program library

V. Common fault information and solutions

1. Image acquisition problems

Fault phenomenon: blurred or missing image

Possible causes: lens contamination, abnormal light source, camera failure

Solution:

Clean the optical components (use special cleaning tools)

Check the light source brightness setting

Recalibrate the camera

2. Conveyor system failure

Failure phenomenon: board stuck or poor transmission

Possible causes: improper track width setting, loose belt, sensor failure

Solution:

Adjust track width

Check and adjust belt tension

Clean or replace sensor

3. Abnormal test results

Failure phenomenon: sudden increase in false alarm rate

Possible causes: process parameter changes, improper program settings, ambient light interference

Solution:

Check actual process parameters

Re-optimize the test program

Ensure stable lighting around the equipment

VI. Maintenance methods

1. Daily maintenance

Cleaning work:

Clean the equipment surface and conveyor track daily

Clean optical components weekly (use a special cleaning kit)

Inspection items:

Check the lubrication of each moving part

Confirm that all fasteners are not loose

Check cable connection status

2. Regular maintenance

Monthly maintenance:

Fully clean the optical system

Check the consistency of light source brightness

Quarterly maintenance:

Replace wearing parts (such as belts, filters, etc.)

Fully calibrate the system

3. Annual professional maintenance

It is recommended that professional maintenance be performed by SAKI certified engineers every year, including:

Optical system precision calibration

Mechanical system accuracy check

Software system comprehensive diagnosis

VII. Optimization use suggestions

Environmental control: Keep the equipment running in an environment with a temperature of 23±3°C and a humidity of 40-70%RH

Data management: Regularly back up the detection program and system parameters

Software update: Regularly update the detection algorithm and system software

Conclusion

As a key equipment for modern electronic manufacturing quality control, the high performance and reliability of the SAKI 3Di MD2 3D AOI system have been widely recognized by the industry